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Applied Materials and Singapores Institute of Microelectronics to Set Up Advanced Packaging Center





Singapore, Singapore (Vocus/PRWEB) 13 April 2011

Applied Materials and Singapores Institute of Microelectronics to Set Up Advanced Packaging Center




Joint facility will develop new tools and integration schemes for growing wafer-level packaging market

Applied Materials, Inc., the global leader in providing manufacturing solutions for the semiconductor, flat panel display and solar photovoltaic industries, today signed an agreement with the Institute of Microelectronics (IME), a world-renowned research institute under the Agency for Science, Technology and Research (A*STAR), to set up a Center of Excellence in Advanced Packaging in Singapore.

The Center will be located at Singapores Science Park II and will focus on developing new capabilities in advanced packaging which is a key growth market for the semiconductor industry. The Center will have a full line of Wafer Level Packaging (WLP) processing equipment and will conduct research in semiconductor hardware, process, and device structures. Applied has led the industry in providing equipment for WLP since 2009 with a comprehensive line of processing systems for production line manufacturing.

A growing number of chip manufacturers have been adopting WLP, a type of chip packaging done at the wafer level to streamline the manufacturing process. Typically, multiple chips are vertically stacked in a single package, called a 3D-IC, and connected using through-silicon via (TSV) technology to deliver higher performance and functionality in a smaller area package. Applied expects many advanced logic devices at the 40nm and below technology nodes to be packaged at the wafer level.

Mr. Russell Tham, Regional President, Applied Materials South East Asia, said, This collaboration is part of Applied Materials strategy to expand our global R&D network and extend our leading position in advanced packaging, bringing our development activities closer to our customers in Asia.

According to Professor Dim-Lee Kwong, Executive Director of IME, The Center is an excellent example of strategic partnerships fostered between two critical players in the global semiconductor value chain. Such a close collaboration will spur the growth of next generation equipment and translate into greater share of the semiconductor market in Asia and the world for Applied Materials, and position Singapore as the country of choice for global semiconductor R&D.

IME is a leading research institute with advanced R&D capabilities in 3D-ICs using TSV technology which is expected to drive future generations of mobile electronic devices. IMEs capabilities in this area and its expertise and commitment to building the 300mm facility one of the most advanced semiconductor R&D facilities in Asia will enable IME to support Applied Materials product development initiatives.

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