San Jose, CA (Vocus) August 18, 2010
Owing to the technological advances and myriad requirements of end-use markets, the semiconductor industry is currently witnessing a major shift from 2D packaging to 3D stacking, which uses surface bump bonding with vias or wires for connections. With tiny footprint, low power consumption, exceptional speed, circuit security and several other advantages, 3D chips provide the paradigm for developing a broader set of electronic products and systems. The Semiconductor industry witnessed a phenomenal transition with the introduction of Ball Grid Array (BGA), Flip Chip (FC), and Chip-Scale Packages (CSP), while packaging industry gained significance since 2000. Through-silicon via (TSV) packaging or three-dimensional integrated circuit (3D IC) technology is expected to significantly enhance the transistor density and cubic density, instead of only the plane density of chips. Significant dynamics in CMOS image sensor, MEMS, analog, logic and memory industries continued and are expected to drive high-volume adoption of 3D TSVs in the subsequent decade. Moreover, novel applications, including HB-LED silicon modules, Power and Solar components are also expected to gain from the 3D TSV market trend and the interconnect technology.
As stated by the new market research report on 3D Chips, the market penetration of 3D IC integration technology in various applications is dependent on the cost associated with specific process, requirement of interconnect density and limitations on form factor. 3D technologies are gradually evolving to handle the issues related to chip signaling, memory latency and restricted communications capacity. Stacking of chipsets and processor is expected to manage performance lapses caused by interconnect delays. Currently, 3D IC is emerging as an efficient solution in cell phone cameras and memory chip stacks.
The 3D TSV interconnects, in addition to 3D packaging offer immense opportunities for 3D integration with significantly lower investments. 3D IC integration systems are classified on the basis of the level of interconnectivity at the bond pad, package and transistor level. While conventional processes of interconnectivity, such as flip chip and wire bond, are being used in the production of packaging levels, the modern 3D integration aims to incorporate TSV technology as the key method for interconnecting. Decreased form factor, cost reduction and enhanced performance are the major drivers for the increased adoption of TSV-based 3D ICs.
However several issues limit the adoption of the TSV-based 3D ICs in the market. Major issues include supply chain factors, test solutions, thermal management factors, and lack of design devices and tools. Information sharing and communication across the supply chain, including designing, testing and production, are the pre-requisites for the adoption of this technology in the market.
Major players profiled in the report include Amkor Technology, GlobalFoundries Inc., Hynix Semiconductor Inc., International Business Machines Corporation, Intel Corporation, Micron Technology Inc., Renesas Electronics Corporation, Samsung Electronics Co. Ltd., Sony Corporation, Tezzaron Semiconductor Corporation, Toshiba Semiconductors, Ziptronix Inc.
The report titled 3D Chips (3D IC): A Global Market Report announced by Global Industry Analysts Inc., provides a comprehensive review of the market, current market trends, key growth drivers, product overview, technological challenges, recent product introductions, recent industry activity, and profiles of major/niche global as well as regional market participants. The report provides annual sales estimates and projections for 3D Chips (3D IC) market for the years 2006 through 2015.
For more details about this comprehensive market research report, please visit http://www.strategyr.com/3D_Chips_3D_IC_Market_Report.asp
About Global Industry Analysts, Inc.
Global Industry Analysts, Inc., (GIA) is a reputed publisher of off-the-shelf market research. Founded in 1987, the company is globally recognized as one of the worlds largest market research publishers. The company employs over 800 people worldwide and publishes more than 1200 full-scale research reports each year. Additionally, the company also offers thousands of smaller research products including company reports, market trend reports, and industry reports encompassing all major industries worldwide.
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