Rohm and Haas Unveils New ACuPLANE Copper Barrier CMP Solution : Pad and Slurry Combo Achieves Controllable Process with Reduced Defectivity and COO

HSINCHU, Taiwan (PRWEB) September 10, 2008

By optimizing the performance of the pad and slurry combination, the ACuPLANE system can achieve an order of magnitude in defectivity reduction, while giving customers higher levels of control to minimize metal and dielectric loss. Additionally, the ACuPLANE system can significantly minimize post-polish topography across the wafer, and reduce stress on the wafer to avoid dishing, erosion and delamination of porous ultra low-k films.

 

“The ACuPLANE system offers chemistries tunable to specific customer process requirements,” said Cathie Markham, CTO, Rohm and Haas Electronic Materials. “It also directly addresses customer demands for longer pad lifetimes and consistent, stable performance. Our customers are seeing very promising results for nodes as advanced as 32 nm.”

 

The EcoVision 4000 pad’s novel design increases the point contact area on the wafer surface which directly reduces stress on the underlying film stack. This results in defect reduction and improved die yields by minimizing scratches, chatter marks, and film delamination across the wafer. The ACuPLANE 5000 Series slurry is designed to give users flexibility and control over removal rates and selectivities to address specific process requirements. The slurry can be implemented in either a non-selective or selective approach to maintain or correct the incoming topography to enable superior


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Ibrar Ayyub

I am an experienced technical writer holding a Master's degree in computer science from BZU Multan, Pakistan University. With a background spanning various industries, particularly in home automation and engineering, I have honed my skills in crafting clear and concise content. Proficient in leveraging infographics and diagrams, I strive to simplify complex concepts for readers. My strength lies in thorough research and presenting information in a structured and logical format.

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