Franklin, MA (PRWEB) August 4, 2005 –
Speedline Technologies has announced the release of lead-free enhancements for its Electrovert® Econopak® Gold Wave Soldering Systems.
Designed to provide medium volume electronics manufacturers with the utmost benefit, efficiency, and versatility, all Econopak Gold systems ship lead-free process ready, said Richard Burke, Speedline Technologies, Product Manager, Wave Soldering Equipment.
The Econopak Gold system is a compact, economical wave soldering solution offering a host of performance refinements and available features. The release of both the UltraFill Nozzles and a Quick Change Solder Pot, enhance its lead-free capabilities.
Speedlines UltraFill Nozzles are 40% percent wider than the traditional tin/lead nozzle. Their unique design and placement mean less superheat is required to reflow solder joints in the second wave. Significant benefits include improved hole fill, bridge defect reduction and reduced dross formation. The nozzles are available in Melonite Corrosion Resistant Stainless Steel or Titanium material.
An optional Nitrogen shroud encompasses the UltraFill Nozzles in the pot. It allows for air or nitrogen operation and its lift design ensures ease of maintenance and dedrossing without the need for change or removal.
The Econopak Golds Quick Change Solder Pot allows for the easy switch between two alloys such as tin/lead and lead-free solders. This results in a significant labor savings versus a manual changeover. The unit includes a second solder pot with motors, pumps, flow ducts, nozzle and 2 trolleys.
The lead-free ready Econopak Gold platform remains highly flexible and can be fitted with many features usually available only on high volume systems, including nitrogen inerting, convection pre-heating, Rotary chip wave, gas knife de-bridging technology, and alternate fluxing options. The solder module provides ideal wave dynamics for densely populated circuits, SMT components and difficult-to-solder geometries. The Econopak Gold system processes boards up to 400mm (16″) and comes standard with 1.2m (4′) of preheat.
The lead-free ready Econopak Gold and all lead-free upgrades are available immediately from Speedline distributors and representatives. For additional information, contact Speedline Technologies at 1-508-520-0083 or visit http://www.speedlinetech.com.
About Speedline Technologies
Speedline Technologies is the global leader in process knowledge and expertise for the PCB assembly and semiconductor industries. Based in Franklin, Massachusetts, U.S.A., the company markets five best-in-class brands Accel microelectronics cleaning equipment; Camalot dispensing systems; Electrovert wave soldering, reflow soldering, and cleaning equipment; MPM stencil and screen printing systems; and Protect global services, support, and training solutions. Speedline was named as the 2005 Surface Mount Technology Company of the Year by Frost & Sullivan.
For more information, visit us at http://www.speedlinetech.com, or contact us at:
USA: Speedline Technologies, 16 Forge Park, Franklin, MA 02038 USA, Tel: 1-508-520-0083, Fax: 1-508-520-2288, E-mail: [email protected];
Europe: Speedline Technologies GmbH, Im Gefierth 14, 63303 Dreieich, Germany, Tel: +49 (0)6103/832-0, Fax: +49(0)6103/832-299, E-mail: [email protected];
Asia: Speedline Technologies Asia Pte Ltd, 150 Kampong Ampat, #05-08 KA Centre, Singapore 368324, Tel: 65-6286-6635, Fax: 65-6289-9411, E-mail: [email protected].
Note to Editors:
Download high resolution photos from: http://www.tizinc.com/speedline
# # #
More Electronic Circuit Press Releases
