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NexLogic Technologies Doubles Production Capacity With New PCB Assembly Systems; Helps OEM Customers Achieve Time-to-Market, Time-to-Revenue Goals

San Jose, CA (PRWEB) May 21, 2009 NexLogic Technologies, Inc. has announced the purchase and installation of new and highly advanced printed circuit boards (pcb) assembly equipment, allowing it to increase its pcb production capacity. The new equipment includes two pick and place systems, MyData Model MY15 and Fuji XPF and a Speedline Technologies Model […]

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Advanced DuPont Coatings Help Chinese Automakers Achieve Sustainability Goals

Shenyang, PRC (Vocus) June 25, 2009 A new DuPont development laboratory and manufacturing facility in China are accelerating the adoption of coatings with improved environmental performance by Chinese automakers. The technical center, located in Shanghai, and the manufacturing operations in Changchun allow DuPont scientists to respond to their customers needs quickly and efficiently.   The

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