applications

Analog Devices’ High-Speed Multi-Channel Analog-to-Digital Converters Reduce System Board Space : – ADI’s AD9239 and AD9639 quad 12-bit analog-to-digital converters use 50 percent less PCB area, yielding space savings for high-bandwidth data acquisition applications.

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NORWOOD, Mass. (PRWEB) November 19, 2008 The 250-MSPS (mega-sample-per-second) AD9239 incorporates an efficient packetized output scheme, while the 210-MSPS AD9639 supports a JESD204-compliant output scheme. Both ADCs feature on-chip PLL (phase-locked loop) and input buffer circuits, which are designed for low cost, low power, small size, and ease of use. The new ADCs require a […]

Analog Devices’ High-Speed Multi-Channel Analog-to-Digital Converters Reduce System Board Space : – ADI’s AD9239 and AD9639 quad 12-bit analog-to-digital converters use 50 percent less PCB area, yielding space savings for high-bandwidth data acquisition applications. Read More »

Electrolock Introduces New Solder Pallet Material for Extreme Performance Applications

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Hiram, Ohio (PRWEB) January 6, 2009 Electrolock-XP, a new solder pallet material, meets the demanding flatness and thickness requirements for soldering applications, reduces downtime and sets new standards for durable performance in lead-free and halide flux soldering systems.   Electrolock-XP was manufactured in the United States using an innovative, patent-pending molding and processing technology. Electrolock-XP

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OnChip Introduces Thin Film Precision Silicon Chip Resistors for Hi-Rel Applications

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Santa Clara, CA (Vocus) February 4, 2009 A global leader in Integrated Passives Devices (IPD), OnChip today introduced a family of Thin Film Silicon wire-bondable Resistor Chips. These products use sophisticated thin-film manufacturing process featuring a high-stability, self-passivating and moisture-resistant Tantalum Nitride resistor element. Consisting of a single and dual value resistors, these chips offer

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OnChip Introduces Thin Film Multi-tapped Silicon Chip Resistors for Hi-Rel Applications

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Santa Clara, CA (Vocus) April 24, 2009 A global leader in Integrated Passive Devices (IPD), OnChip today introduced a miniature Thin Film Silicon wire-bondable Resistor Chip that can offer a wide range of values. Using advanced thin-film manufacturing techniques and featuring high-stability, self-passivating and moisture-resistant Tantalum Nitride resistor elements, this product is ideal for developing

OnChip Introduces Thin Film Multi-tapped Silicon Chip Resistors for Hi-Rel Applications Read More »

Elliptic Technologies Debuts Security Engine for 4G LTE Mobile Backhaul Applications

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Ottawa, Canada (PRWEB) January 25, 2012 Elliptic Technologies, a leading supplier of security semiconductor IP and software has announced the release of its IPsec Security Protocol Processor, SPP-230, to address the security needs of the 4G LTE mobile backhaul networks. This unique security engine accelerates IPsec packet processing to allow for multi Gbps performance by

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Lavender targets automotive applications – the latest graphics display controller from Fujitsu Microelectronics Europe

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(PRWEB) November 23, 2000 November 21st 2000. The latest graphics display controller developed by Fujitsu is dedicated to graphical applications requiring small LCD displays for automotive and man machine interfaces.   Designed specifically for embedded and automotive applications with low cost, low power requirements, the MB87J2120 “Lavender” GDC is the next member of the new

Lavender targets automotive applications – the latest graphics display controller from Fujitsu Microelectronics Europe Read More »

Fujitsu Introduces Enhanced Low Power Version of 16Mbit High Density RAM for Next Generation Mobile Phone Applications

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(PRWEB) December 9, 2000 Second generation 16Mbit High Density RAM, Based on Fujitsu’s FCRAM Architecture, Reduces Power Requirements and Enhances Refresh-Free Operation   December 6 2000 – Fujitsu Microelectronics Europe has introduced the industry’s newest Application Specific Memory (ASM), a second generation 16Mbit RAM with enhanced power requirements as low as 70 microamps.   Fujitsu’s

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Fujitsu Microelectronics Europe’s single-CAN 32-bit microcontroller suits a host of automotive applications

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(PRWEB) October 27, 2001 London, October 25 2001 – Fujitsu Microelectronics Europe’s growing family of well-proven, 32-bit CAN-microcontrollers, designed within the company’s European Microcontroller Design Centre (EMDC), encompass devices providing both high and mid-end automotive solutions targeted at applications including dashboard, body-electronics and information display. Via its new MB91F364G, Fujitsu now offers a 32-bit

Fujitsu Microelectronics Europe’s single-CAN 32-bit microcontroller suits a host of automotive applications Read More »

Electronic Interconnect Offers PCBs for Photovoltaic (PV), Solar Applications

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Chicago, IL (PRWEB) March 17, 2010 Electronic Interconnect (EI) offers Photovoltaic (PV) product manufacturers a widerange of printed circuit board materials, constructions, and PCB design expertise especially for high-power devices, LED, RF and Wireless electronic assemblies, including inverters and module assembly. These types of assemblies have special requirements for heat management characteristics, and this is

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NEW INTELLISENSOR FUEL-LEVEL SENSORFEATURING NO MOVING PARTS IS IDEAL FOR PERFORMANCE APPLICATIONS

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(PRWEB) March 7, 2003 LANCASTER, PA.–November, 2002. Maxima Technologies, the group enterprise that produces the AST, Datcon and Stewart Warner brands of vehicle instruments, has introduced a new version of its standard IntelliSensor unit, the award-winning, fully electronic, patented fuel-level sensor launched in 1997 currently used by numerous O.E.M.s in on- and off-road vehicles. Called

NEW INTELLISENSOR FUEL-LEVEL SENSORFEATURING NO MOVING PARTS IS IDEAL FOR PERFORMANCE APPLICATIONS Read More »

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