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SAMSUNG UNVEILS 12 LAYER 3D TSV CHIP PACKAGING TECHNOLOGY

SAMSUNG UNVEILS 12-LAYER 3D-TSV CHIP PACKAGING TECHNOLOGY

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An industry’s first, the 12-layer 3D-TSV (Through Silicon Via) technology developed by Samsung Electronics enables the stacking of 12 DRAM chips using more than 60,000 TSV holes, while maintaining the same thickness as current 8-layer chips. By Julien Happich @ eenewseurope.com Developed for the mass production of high-performance chips, the layered packaging technology requires pinpoint accuracy […]

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3D PRINTED ORGAN ON CHIP

3D PRINTED ORGAN-ON-CHIP

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Researcher at Harvard University had been working to build new microphysiological systems (MPS), also known as organs-on-chips, that can mimic the operation of the structure and function of native tissue. By developing such systems, they are replacing the conventional way of measuring and testing synthetic organs -usually by testing them first on animals.   Although such a solution

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A data acquisition system on a chip

A data-acquisition system on a chip

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Multifunction data-acquisition systems have been around for a long time as stand-alone instruments, plug-in cards, cabled computer peripherals, and embedded in systems. Such systems are often designed with separate ADCs, DACs, and digital I/O devices. Many microcontrollers include ADCs and DACs, but that locks you into using that device. The AD5592R from Analog Devices combines

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Global AVR Series Single Chip Microcomputer Market 2019 Industry Development and Growth Forecast to 2023

Global AVR Series Single-Chip Microcomputer Market 2019 Industry Development and Growth Forecast to 2023

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According to a new market study published by Industry Research, titled “Global AVR Series Single-Chip Microcomputer Market 2018 by Manufacturers, Regions, Type and Application, Forecast to 2023”, the market size of AVR Series Single-Chip Microcomputer is expected to see the highest growth by 2023.  The complete research assessment provides analysis of industry’s new upgrades, critical trends, present

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ACCURACY TEMPERATURE SENSOR

TMP117 +/- 0.1°C ACCURACY TEMPERATURE SENSOR

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This device is the industry’s first to exceed Class-A platinum resistive temperature detector (RTD) medical grade accuracy across a wide temperature range. As a single-chip digital alternative to a platinum RTD, the TMP117 enables engineers to reduce system complexity and layout challenges, as well as slash power usage and extend battery life. The TMP117 is a high-precision

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GYRFALCON LAUNCHES SECOND GEN AI ACCELERATOR CHIP

GYRFALCON LAUNCHES SECOND-GEN AI ACCELERATOR CHIP

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Lightspeeur 2803 – a follow on to the Lightspeeur 2801S ASIC – enables upgrading of existing data center hardware to speed AI processing while providing 10X reduction in energy consumption. Gyrfalcon Technology Inc. (GTI), the world’s leading developer of low-cost, low-power, high-performance Artificial Intelligence (AI) processors, today announced the availability of its second-generation chip, the Lightspeeur 2803 AI Accelerator.

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COMMERCIALISED 1005 SIZE METAL POWER INDUCTOR

COMMERCIALISED 1005-SIZE METAL POWER INDUCTOR

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The expansion of the line-up of the metal multilayer chip power inductor MCOIL MC series, from TAIYO YUDEN, which uses a metallic magnetic material, as well as the commercialisation of the tiny metal power inductor MCEE1005(1.0×0.5×0.55mm, maximum height), has been announced. This power inductor is used as a power choke coil in power supply circuits for wearable devices, smartphones,

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TINY FPGA BX – A TINY, OPEN SOURCE FPGA DEVELOPMENT BOARD FOR MAKERS

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The TinyFPGA boards from Luke Valenty (TinyFPGA) are a series of low-cost, open-source FPGA development boards. These boards offer an inexpensive way to get an introduction to the world of FPGAs. If you have ever considered working with an FPGA before, you will know how difficult they could be especially for those new to the game. TinyFPGA boards are an

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RDA5981 is a $1 Fully Integrated WiFi Chip with an ARM Core

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RDA’s RDA5981 is a fully integrated low-power WiFi chip from RDA Microelectronics. RDA5981 is a fully built WiFi chip highly intended for applications in the areas of a smart home, audio applications and IoT applications. The RDA5981 is being used in devices running Baidu DuerOS, the Chinese alternative to Amazon Alexa or Google Assistant. During

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