Density

NEW LOW POWER GENERAL PURPOSE LATTICE FPGA FAMILY

NEW LOW-POWER, GENERAL-PURPOSE LATTICE FPGA FAMILY

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Lattice Semiconductor has introduced a new general-purpose FPGA family that has been developed to combine high I/O density, low-power, small packages and fast interfaces. [via] The Lattice Certus-NX series provides up to double the I/O density per mm 2 of similar FPGAs, and provides power savings, a small footprint, reliability, and instant-on performance. Devices in the family support […]

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TEXAS INSTRUMENTS TPSM846C24 HIGH DENSITY STEP DOWN POWER MODULE

TEXAS INSTRUMENTS TPSM846C24 HIGH-DENSITY STEP-DOWN POWER MODULE

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Texas Instruments TPSM846C24 35A Power Modules offer a fixed frequency and incorporate the controller, power MOSFETs, inductor, and associated components into a thermally enhanced, surface-mount package. To set the operating parameters of the module, the user supplies the input and output capacitors as well as a few other passive components. A two-phase power solution can be achieved

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Supercap energy density rivals batteries

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Using a hybrid silica sol-gel material and self-assembled monolayers of a common fatty acid, researchers have developed a new capacitor dielectric material that provides an electrical energy storage capacity rivaling certain batteries, with both a high energy density and high power density.   If the material can be scaled up from laboratory samples, devices made

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Double Decker PCB Connectors for High Density Applications

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(PRWEB) February 9, 2005 Camden Electronics has launched a new range of double-decker PCB connectors designed for use in applications where a high density of connections is required. Suitable for use in a wide range of electrical and lighting applications, the new CTB9350DD series connectors provide fast and easy interconnection between a printed circuit

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The Demand for Increased Functionality, Improved Signal Integrity and Interconnect Density is Driving the Requirement for Flexible and Flex-Rigid Substrates

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Dublin (PRWEB) October 17, 2005 Research and Markets (http://www.researchandmarkets.com/reports/c25862) has announced the addition of Flexible and Flex-Rigid Printed Circuits 2005 – A Global Market and Technology Review 2004-2010 to their offering   This study provides a totally integrated assessment of the global flexible and flex-rigid substrate supply chain. Issues relating to technology, markets and strategic

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DVEO Releases New 200 Channel Enterprise Class Multiblade Transcoder Streaming System at an Exceptional Price, Performance, and Transcode Density Point

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San Diego, CA (PRWEB) January 12, 2012 DVEO, the broadcast division of Computer Modules, Inc. (CMI), is proud to introduce the latest addition to their unique product family of real time adaptive bitrate streaming transcoders.   Now shipping, the MultiStreamer IP/IP (Brutus) is an MPEG-2 to H.264, or H.264 to MPEG-2, transcoder Blade System with

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LaunchPoint Technologies Announces New High Efficiency, High Power Density, Halbach Array Electric Motor

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Santa Barbara, CA (PRWEB) September 21, 2009 LaunchPoint Technologies, Inc. has completed optimization and initial prototyping for a high efficiency, high power density, Halbach array electric motor. With a total weight of only 1.4 pounds, this electric motor produces 7 horsepower at 8400 rpm with 95 percent efficiency. At 5 horsepower per pound, this electric

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Fujitsu Introduces Enhanced Low Power Version of 16Mbit High Density RAM for Next Generation Mobile Phone Applications

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(PRWEB) December 9, 2000 Second generation 16Mbit High Density RAM, Based on Fujitsu’s FCRAM Architecture, Reduces Power Requirements and Enhances Refresh-Free Operation   December 6 2000 – Fujitsu Microelectronics Europe has introduced the industry’s newest Application Specific Memory (ASM), a second generation 16Mbit RAM with enhanced power requirements as low as 70 microamps.   Fujitsu’s

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Complementary TranSwitch and Octasic Semiconductor Devices Deliver High Density Voice Gateway Card

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Shelton, CT and Montreal, QC (PRWEB) February 17, 2005 TranSwitch TEPro, Octasic OCT8304 and OCT6100 interface seamlessly in OEM design and field trials. TranSwitch® Corporation (NASDAQ: TXCC), and Octasic Semiconductor Inc. today announced an integrated solution for voice over packet (VoP) gateway implementations that allows OEMs to increase density and lower costs. Through the complementary

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Micro/sys Releases High Density StackableUSB Expansion Board with 96 Lines of Digital I/O

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Montrose, CA (PRWEB) May 24, 2007 The Micro/sys USB196 is a high density digital I/O board that implements the new StackableUSB standard. The USB196 offers high quantities of digital I/O for OEM systems by providing four 82C55s that support 96 TTL I/O lines. The 8-position DIP switch and 8 LEDs can be used for debugging

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