Electroplating

Technic Releases New Tin-Silver Alloy Electroplating Process: Technistan Ag

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Cranston, RI (PRWEB) October 15, 2009 Technic has announced the release of Technistan Ag, a new, patent pending, high speed tin-silver alloy electroplating process for use in electronic connector and component applications. Technistan Ag is designed to produce a 95% tin / 5% silver bright electrodeposit at current densities of up to 300 amps per […]

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SVTC, Amerimade Technology and Shanghai Sinyang Semiconductor Materials Form Partnership to Expand Advanced Electroplating Process Capabilities

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SAN JOSE, CA (PRWEB) October 19, 2011 SVTC Technologies, the premier innovation partner for accelerating nanotechnology development and commercialization, announced today that it is partnering with Amerimade Technology and Shanghai Sinyang Semiconductor Materials to advance process development and production readiness for electroplating applications. This unique combination of engineering expertise, production knowhow, chemistry products and electroplating

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