Rohm

Rohm and Haas Announces Leadership Changes in its Electronic Materials Business Group

PHILADELPHIA, Pennsylvania (Vocus) January 29, 2007 Rohm and Haas Company’s (NYSE:ROH) Electronic Materials business group, an innovator of advanced material solutions for the electronics industry, has announced several changes in its executive leaders. These moves, effective immediately, are associated with the company’s “Vision 2010” growth strategy and reorganization, which was announced in October 2006.   […]

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Rohm and Haas VP of Technology to Speak at Society of Women Engineers ‘Spring Mingle’ on May 10 in Newark, DE

Newark, DE (PRWEB) April 18, 2007 Rohm and Haas Electronic Materials Vice President of Technology Cathie Markham will be the keynote speaker at the DelMar Peninsula Section of the Society of Women Engineers’ “Spring Mingle” dinner and networking event at the Deerfield Golf & Tennis Club on May 10.   Speaking on the topic, “Finding

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One of Nation’s Top Chemists to Address Students at 11th Annual Rohm and Haas Electronic Materials Invitational Science Fair

Freeport, NY (PRWEB) April 20, 2007 Dr. Ronald Breslow, professor of chemistry at Columbia University and a 1991 winner of the U.S. National Medal of Science, will deliver the keynote address at the 11th Annual Rohm and Haas Electronic Materials Invitational Science Fair on April 22, 2007, at Great Neck South High School, 341 Lakeville

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Top Long Island, N.Y., High School Students Set to Compete in 13th Annual Rohm and Haas Electronic Materials Invitational Science Fair

Freeport, NY (PRWEB) March 28, 2008 Three hundred top students from 12 Long Island, N.Y. high schools will test their scientific prowess and research skills at the 13th Annual Rohm and Haas Electronic Materials Invitational Science Fair on Sunday, April 13, 2008 at Manhasset High School, 200 Memorial Place, Manhasset, NY 11030. The students, who

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Rohm and Haas Unveils New ACuPLANE Copper Barrier CMP Solution : Pad and Slurry Combo Achieves Controllable Process with Reduced Defectivity and COO

HSINCHU, Taiwan (PRWEB) September 10, 2008 By optimizing the performance of the pad and slurry combination, the ACuPLANE system can achieve an order of magnitude in defectivity reduction, while giving customers higher levels of control to minimize metal and dielectric loss. Additionally, the ACuPLANE system can significantly minimize post-polish topography across the wafer, and reduce

Rohm and Haas Unveils New ACuPLANE Copper Barrier CMP Solution : Pad and Slurry Combo Achieves Controllable Process with Reduced Defectivity and COO Read More »

Rohm and Haas Gains Strong Market Traction with Defect and Slurry Reduction Groove Designs for CMP Pads : Products in Testing and Manufacturing in Leading-Edge, High Volume Fabs Worldwide

HSINCHU, Taiwan (PRWEB) September 10, 2008 Rohm and Haas’s defect reduction groove has already been adopted in high volume manufacturing (HVM) by customers in Europe, Korea, North America and Taiwan. While currently being used on the Rohm and Haas IC1000 AT CMP pad for the 90 nm process node and below, multiple customers are now

Rohm and Haas Gains Strong Market Traction with Defect and Slurry Reduction Groove Designs for CMP Pads : Products in Testing and Manufacturing in Leading-Edge, High Volume Fabs Worldwide Read More »

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