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SAMSUNG UNVEILS 12 LAYER 3D TSV CHIP PACKAGING TECHNOLOGY

SAMSUNG UNVEILS 12-LAYER 3D-TSV CHIP PACKAGING TECHNOLOGY

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An industry’s first, the 12-layer 3D-TSV (Through Silicon Via) technology developed by Samsung Electronics enables the stacking of 12 DRAM chips using more than 60,000 TSV holes, while maintaining the same thickness as current 8-layer chips. By Julien Happich @ eenewseurope.com Developed for the mass production of high-performance chips, the layered packaging technology requires pinpoint accuracy […]

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SAMSUNG ANNOUNCES 5G CAPABLE EXYNOS PROCESSOR

SAMSUNG ANNOUNCES 5G-CAPABLE EXYNOS PROCESSOR

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Samsung Electronics Co. Ltd. has announced the Exynos 980 processor with an integrated 5G modem capable of download speeds of up to 2.55Gbps. report by Peter Clarke @ eenewsembedded.com The chip is designed in Samsung’s 8nm manufacturing process technology and the CPU has a six-two split little-big architecture divided between two 2.2GHz Cortex-A77 cores and six 1.8GHz Cortex-A55

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Samsung launches industry’s first 12Gb LPDDR4 DRAM

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The newest LPDDR4 is expected to significantly accelerate the adoption of high capacity mobile DRAM worldwide. The 12Gb LPDDR4 brings the largest capacity and highest speed available for a DRAM chip, while offering excellent energy efficiency, reliability and ease of design – all essential to developing next-generation mobile devices. “By initiating mass production of 12Gb

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Samsung Researchers Nearly Double Lithium-ion Battery Capacity

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a) A low-magnification tunneling electron microscope (TEM) image of Gr–Si nanoparticle (NP). (b) A higher-magnification image for the same Gr–Si NP from the white box in a. (Insets) The line profiles from the two red boxes indicate that the interlayer spacing between graphene layers is ~3.4 Å, in good agreement with that of typical graphene layers

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Samsung announces Exynos 5 Octa for new generation of mobile devices

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Samsung Electronics announced that its new Exynos 5 Octa application processor is scheduled for mass-production in the second quarter of 2013. The Exynos 5 Octa features an unprecedented eight-core ARM big.LITTLE architecture based on the Cortex-A15 CPU, technology built for efficient handling of multitasking abilities for high-end mobile devices today.

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Samsung produces new high-performance enterprise SSDs for data centers

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Samsung Electronics today announced that it is producing advanced solid state drives (SSDs) that are designed specifically for use in servers and enterprise storage systems. These drives – the SM843 and the SM1625 – will be particularly useful as high-speed storage for a wide range of server and storage applications that depend on extremely fast data writing including social media in the cloud, SQL database logs, media streaming, virtualization, video on demand and online transaction processing (OLTP).

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Intel, Samsung, TI and Other Leading Semiconductor Vendors to Participate in China’s Biggest IC Event

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HONG KONG (PRWEB) February 26, 2006 More than 200 semiconductor companies including IC giants Intel, Samsung and Texas Instruments will showcase their latest technologies at Global Sources 11th International Integrated Circuit-China Conference & Exhibition (IIC-China) in March.   Other participating companies include Analog Devices, Freescale, Infineon, Micron, NEC, Philips, Renesas, Spansion, STMicroelectronics and Toshiba.  

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Samsung Revitalizes Notebook PC Market with Launch of New Premium Portables

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Singapore (PRWEB) July 24, 2009 Samsung Electronics today unveiled a variety of new notebook PC products, signalling its commitment to grow its regional market presence in the mobile computing segment. The new premium, high-performance line-up includes five different models from the X and R Series notebook PCs and N Series mini notebooks that will cater

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Edge Electronics, Inc. Announces Distribution Agreement with Samsung Semiconductor, Inc.

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Bohemia, NY (PRWEB) January 15, 2009 Edge Electronics, Inc., a leading distributor of electronic components and display solutions , recently entered into a distribution agreement with Samsung Semiconductor, Inc., a leading manufacturer of memory, system LSI components, storage devices, and LCD panels. The agreement authorizes Edge Electronics to distribute all four categories of Samsung components

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