Scheme

MonolithIC 3D Inc. Announces Ultra-Scale Integration Scheme

San Jose, CA (PRWEB) December 20, 2011 MonolithIC 3D Inc., a leading 3D-IC company, announced its Ultra-Scale Integration scheme last week. The technology promises to improve the integration level of chips by more than 100x, thereby providing breakthrough performance improvements for supercomputers, servers and many other applications. Ultra-Scale Integration has been a goal of […]

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MonolithIC 3D Inc. Announces Yield Repair Scheme for Wafer-Level 3D-ICs

San Jose, California (PRWEB) January 24, 2012 One of the commonly quoted challenges for wafer-level 3D-IC stacking is yield. When multiple wafers are stacked atop each other, yield of that 3D stack has the potential to reduce exponentially. For example, when four wafers with 70% yield are stacked atop each other, the net yield could

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