Global 3D Chips/3D IC Market to Reach US$5.2 Billion by 2015, According to a New Report by Global Industry Analysts, Inc.

San Jose, CA (Vocus) August 18, 2010 Owing to the technological advances and myriad requirements of end-use markets, the semiconductor industry is currently witnessing a major shift from 2D packaging to 3D stacking, which uses surface bump bonding with vias or wires for connections. With tiny footprint, low power consumption, exceptional speed, circuit security and […]

Global 3D Chips/3D IC Market to Reach US$5.2 Billion by 2015, According to a New Report by Global Industry Analysts, Inc. Read More »