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FORLINX FETMX8MM C SOM FOR OPTIMIZED AUDIO PERFORMANCE

FORLINX FETMX8MM-C SOM FOR OPTIMIZED AUDIO PERFORMANCE

Forlinxā€™sĀ SoM FETMX8MM-CĀ contributes to the ever-growing list of tiny, Linux-friendly modules built around NXPā€™s i.MX8M Mini. This new board focuses on a variety ofĀ digital audioĀ processing interfaces. Recent same form factor boards include MYIRā€™sĀ MYC-C8MMXĀ and Innocommā€™sĀ WB15. This new 56 x 36mm SoM FETMX8MM-C module runsĀ Android 9.0Ā orĀ Linux 4.14Ā on i.MX8M Mini. It has 2GB DDR4, 8GB eMMC, up to -40 […]

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2 CHANNEL USB THERMOCOUPLE SENSOR USING STM32

2-CHANNEL USB THERMOCOUPLE SENSOR USING STM32

AĀ thermocoupleĀ is one of the most utilized sensors nowadays when measuring temperature. From the tip of your soldering iron to your gas oven, its value is undeniable, so if you are not integrating one in your projects, then you should! They are cheap and extremely useful. If you are,Ā you probably wanted to test a thermocouple or

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ARTILAS TURNKEY PRE INTEGRATED EMBEDDED SINGLE BOARD COMPUTER SBC 7530

ARTILAā€™S TURNKEY PRE-INTEGRATED EMBEDDED SINGLE BOARD COMPUTER SBC-7530

Artila Electronics, which specializes in the development and manufacture of Linux-ready Arm embedded industrial computers, is glad to announceĀ SBC-7530, an ARM based Cortex-A7 turnkey single board computer, delivers stable, strong system performance in a low power platform; itā€™s designed specifically for applications which require multiple I/O connection, networking connectivity and high performance graphic interfaces. With

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HUGEN LAUNCHES PORTABLE TINYSA SPECTRUM ANALYSER

HUGEN LAUNCHES PORTABLE TINYSA SPECTRUM ANALYSER

RF testing is getting quite popular these days, with many devices featuring wireless capabilities. However, RF test devices are quite expensive, therefore slowing down itā€™s popularity. However, thereā€™s a new RF test device in town which is very affordable, called theĀ TinySA. Under development since February, the RF is now available for pre-order. The tinySA is

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MYIR INTRODUCES FZ5 EDGEBOARD AI BOX AND ACCELERATOR CARD

MYIR INTRODUCES FZ5 EDGEBOARD AI BOX AND ACCELERATOR CARD

MYIR introducesĀ FZ5 EdgeBoard AI BoxĀ which is aĀ rugged and fanless AI (Artificial intelligence) edge computing box with a built-inĀ FZ5 AI Accelerator Card. The AI Box is based onĀ Xilinx Zynq UltraScale+ ZU5EV MPSoCĀ which features a 1.5 GHz quad-coreĀ ARM Cortex-A5364-bit application processor, a 600MHz dual-core real-timeARM Cortex-R5Ā processor, a Mali400 embedded GPU, a H.264/H.265 Video Codec Unit (VCU) and

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ADVANTECH INTRODUCES HIGH PERFORMANCE 3.5ā€³ SBC MIO 5393 WITH 9TH GEN. INTELĀ® XEONĀ®COREā„¢

ADVANTECH INTRODUCES HIGH-PERFORMANCE 3.5ā€³ SBC MIO-5393 WITH 9TH GEN. INTELĀ® XEONĀ®/COREā„¢

Advantech,Ā a leading global provider of IoT systems and embedded platforms, is pleased to announce the latest 3.5ā€³ SBCĀ MIO-5393Ā powered by 9thĀ Gen. IntelĀ®Ā XeonĀ®/Coreā„¢. Featuring a compact 146 x 102 mm (5.78 x 4.01 in) design, this single board computer offers impressive I/O functionality and domain-focused features like CANBus. Advantechā€™s embedded small form-factor SBCā€™s are designed to support

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ADVANTECH RELEASES HIGH PERFORMANCE 3.5ā€³ SBC MIO 5373 WITH 8TH GEN. INTELĀ® COREā„¢ PROCESSORS

ADVANTECH RELEASES HIGH-PERFORMANCE 3.5ā€³ SBC MIO-5373 WITH 8TH GEN. INTELĀ® COREā„¢ PROCESSORS

Advantech, a leading global provider of IoT systems and embedded platforms, is pleased to announce the latest 3.5ā€³ SBCĀ MIO-5373Ā based on the low powerĀ 8th Gen. Intel Core SoC. Featuring compact 146 x 102 mm dimensions, theĀ MIO-5373Ā design not only offers impressive I/O functionality but also provides domain-focused features like CANBus and wide-range power input. It is ideally

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NANO SPOT WELDING JUST GOT EASY AND AFFORDABLE

NANO: SPOT WELDING JUST GOT EASY AND AFFORDABLE

One of the major focuses of the maker movement since time immemorial has been the development of a makeshift version of tools with the goal of making them cheaper and more accessible. This focus has been more pronounced in recent times with several tools likeĀ CNCĀ andĀ 3DprintersĀ being all open-source, decentralized, and affordable to regular folks. To take

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FANLESS EMBEDDED SYSTEMS WITH AMD RYZEN V1000 R1000 SOCS

FANLESS EMBEDDED SYSTEMS WITH AMD RYZEN V1000/R1000 SOCS

IBASE Technology Inc., a world leader in the manufacture of industrial motherboards and embedded systems, has unveiled theĀ ASB200-918Ā series based on the IB918 3.5-inch form factor SBC supportingĀ AMD RyzenĀ SoCs (V1605B/V1202B/R1606G/R1505G). The four models in the series bring together the powerful performance of the ā€œZenā€ CPU and ā€œVegaā€ GPU architectures to deliver a new class of embedded

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FIRST COM HPC AND NEXT GEN COM EXPRESS

FIRST COM-HPC AND NEXT-GEN COM EXPRESS

congatec fuels launch of 11th Gen IntelĀ® Coreā„¢ processors with two great new design options In parallel with the 11th Gen IntelĀ® Coreā„¢ processor launch (code named ā€œTiger Lakeā€), congatec ā€“ a leading vendor of embedded computing technology ā€“ announces the availability of both its first COM-HPC Client size A module and a next generation COM

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