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The Demand for Increased Functionality, Improved Signal Integrity and Interconnect Density is Driving the Requirement for Flexible and Flex-Rigid Substrates




Dublin (PRWEB) October 17, 2005

Research and Markets (http://www.researchandmarkets.com/reports/c25862) has announced the addition of Flexible and Flex-Rigid Printed Circuits 2005 – A Global Market and Technology Review 2004-2010 to their offering




This study provides a totally integrated assessment of the global flexible and flex-rigid substrate supply chain. Issues relating to technology, markets and strategic business issues have been researched in detail. A key part of this study is the identification of new emerging applications, technologies and business opportunities for all companies in the supply chain.

Flexible and flex-rigid substrates are now a key emerging technology in next generation electronic system design and development and IC packaging. Until now flex technology was seen as a specialist and niche substrate technology. The demand for increased functionality, improved signal integrity and interconnect density; is driving the requirement for flexible and flex-rigid substrates.

This study presents an up to date current assessment and future forecast of how this dynamic substrate technology will evolve. The research program involved interviewing over 150 suppliers of flex and flex-rigid substrates, end users, EMS and ODM companies, materials and process equipment developers. In addition to this, proven and reliable forecasting techniques were used to predict the future structure and size of this exciting sector.

The study has been developed for senior level managers who are involved in strategic marketing, research and development, business development and new technology introduction.

For more information visit http://www.researchandmarkets.com/reports/c25862

Laura Wood

Senior Manager

Research and Markets

Fax: +353 1 4100 980

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