Rancho Santa Margarita, CA (PRWEB) December 09, 2011
Virtium Technology, Inc., a solutions-driven designer and manufacturer of Industrial Memory and Flash Storage Solutions for Embedded and Telecommunication OEMs announced today its high speed PC3-12800 (DDR3-1600) 8GB VLP RDIMM monolithic module. This offering is targeted toward high performance bandwidth ATCA blade applications and fulfills the current demand for high speed memory in DDR3-1600 compatible systems.
Virtiums high density 8GB dual rank module utilizes x4 2Gbit DRAM monolithic components in the JEDEC standard pin-out and VLP module height of 18.29 mm (.72 inches). Also available is Virtiums ULP (ultra-low profile) module at 17.78 mm height (.70 inches) designed for even more space constrained applications. Both VLP and ULP modules are available in standard 1.5v or 1.35v low power design for optimal power savings.
Virtiums latest DDR3-1600 RDIMM is designed to meet high speed ATCA system requirements, said Phan Hoang, Vice President of Research & Development at Virtium. This design demonstrates the strength of our engineering team. Our years of experience in the industry and collaboration with engineers at major OEMs allow us to continually release such a high-speed, high-density memory module in a very low profile DIMM form factor.”
Features of the module include:
DDR3-1600 Technology
High Density 8GB Design
Available in Very Low Profile & Ultra Low Profile
JEDEC Standard module/ Pin-out
1.5v/ 1.35v Low Power Design
Heat Spreader Available
Lead Free ROHS Compliant
Module Description | Part Numbers
