Electronics News Updates

ASROCK NUC 1100 BOX SERIES – TIGER LAKE UP3 COMPACT MINI PCS THAT OFFER WIFI 6 2.5GBE AND QUAD 4K OUTPUT

ASROCK NUC 1100 BOX SERIES – TIGER LAKE UP3 COMPACT MINI PCS THAT OFFER WIFI 6, 2.5GBE AND QUAD 4K OUTPUT

After the introduction of Intel’s Tiger Lake U-series processors that have support for TDPs up to 28W, notable vendors started adopting the Tiger Lake-U series to launch interesting systems that give a twist to the original NUC’s 100mm x 100mm ultra-compact form-factor (UCFF), and one of them happens to be ASRock Industrial. Barely a month after ASRock unveiled ASRock […]

ASROCK NUC 1100 BOX SERIES – TIGER LAKE UP3 COMPACT MINI PCS THAT OFFER WIFI 6, 2.5GBE AND QUAD 4K OUTPUT Read More »

FROM CAMERAS TO LENSES ALL COMPONENTS ARE PROVIDED BY A SINGLE SUPPLIER

FROM CAMERAS TO LENSES, ALL COMPONENTS ARE PROVIDED BY A SINGLE SUPPLIER

New IDS lenses with 5, 8 and 10 MP: Excellent price-performance ratio. IDS is now offering more than 20 new C-mount lenses. Thanks to lens resolutions of 5, 8 and 10 MP as well as different focal lengths and optical classes, they can be used in numerous application scenarios. In addition, they are characterised by

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INTERFACES FOR MACHINE VISION

INTERFACES FOR MACHINE VISION

Choosing the right interface for your machine vision application is a key decision in your camera selection process. The following sections provide an overview of the different types of cables and connectors available for machine vision applications along with associated pros and cons. Dedicated interfaces Useful for applications where extremely high-speeds or ultra high-resolution necessitate

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MERCURY 2 – BREADBOARD FRIENDLY FPGA DEVELOPMENT BOARD

MERCURY 2 – BREADBOARD-FRIENDLY FPGA DEVELOPMENT BOARD

FPGAs are great and there are a number of cool things you can do with them. But as we come across more and more FPGA development boards, we realize that only a few of them are actually designed to be inserted into a breadboard. The new Mercury 2 development board by MicroNova is a breadboard-friendly Xilinx Artix-7 FPGA board packaged in a

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POMABRUSH A LESS IS MORE APPROACH

POMABRUSH : A LESS IS MORE APPROACH

PomaBrush is a new innovative, minimalist design electric toothbrush that uses silicone bristles. As claimed by the company, the brush only needs to be charged once every four months. It comes with a charging case that can make it charge wirelessly. The case has a USB-C port for charging. It has a soft all-silicone body that is lightweight and perfectly

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ASDM L CFS POWERFUL FLEXIBLE SMART DISPLAY SOLUTION

ASDM-L-CFS: POWERFUL, FLEXIBLE SMART DISPLAY SOLUTION

AAEON, a leading developer in embedded solutions, announces the ASDM-L-CFS smart display module, the first board built to the Intel® SDM Large (SDM-L) form factor to support socket type 8th and 9th Generation Intel® Core™ processors. The ASDM-L-CFS provides uses with a powerful, flexible solution to powering a range of applications including Edge Computing. The ASDM-L-CFS supports the 8th/9th Generation Intel®

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TEXAS INSTRUMENTS TPS61099 SYNCHRONOUS BOOST CONVERTER

TEXAS INSTRUMENTS’ TPS61099 SYNCHRONOUS BOOST CONVERTER

Texas Instruments’ converter features 800 nA ultra-low quiescent current Texas Instruments’ TPS61099x is a synchronous boost converter with 1 µA ultra-low quiescent current. The device is designed for products powered by alkaline batteries, NiMH rechargeable batteries, Li-Mn batteries, or rechargeable Li-Ion batteries where a high efficiency under light-load condition is critical to achieving long battery life operation.

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AAEON LAUNCHES NANOCOM TGU A COM EXPRESS TYPE 10 POWERED BY THE 11TH GENERATION INTEL® CORE™ PROCESSOR FAMILY

AAEON LAUNCHES NANOCOM-TGU, A COM EXPRESS TYPE 10 POWERED BY THE 11TH GENERATION INTEL® CORE™ PROCESSOR FAMILY

To optimize embedded and mobile applications for today’s IoT requirements, AAEON, a leading manufacturer of advanced hardware platforms for SDN, NFV, SD-WAN, and white box uCPE solutions, today announced the launch of  NanoCOM-TGU, a COM Express Type 10 Powered by the 11th Generation Intel® Core™ Processor Family (formerly Tiger Lake UP3). Our NanoCOM-TGU not only offers powerful computing capability, but also

AAEON LAUNCHES NANOCOM-TGU, A COM EXPRESS TYPE 10 POWERED BY THE 11TH GENERATION INTEL® CORE™ PROCESSOR FAMILY Read More »

TESEO LIV3F GNSS PROTOTYPING SOLUTION BY ST

TESEO-LIV3F GNSS PROTOTYPING SOLUTION BY ST

The Teseo-LIV3F is a standalone positioning receiver IC that works simultaneously in multiple constellations (GPS, Galileo, Glonass, BeiDou and QZSS), being an easy to use GNSS (Global Navigation Satellite System) module. It brings the proven accuracy and robustness of the Teseo chips into the hands of everyone. Besides being able to integrate this module into your

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TINY AUTOMOTIVE COMPLIANT 40V DUAL MOSFET BOASTS LOW RDSON RESISTANCE

TINY AUTOMOTIVE-COMPLIANT, 40V DUAL MOSFET BOASTS LOW RDS(ON) RESISTANCE

Diodes Incorporated introduced DMT47M2LDVQ automotive compliant 40V dual MOSFET in a 3.3mm x 3.3mm package for automotive systems. It smartly integrates two n-channel enhancement-mode MOSFETs with the lowest RDS(ON) (10.9mΩ at VGS of 10V and ID of 30.2A). The low on-resistance conduction helps in keeping the losses to a minimum in applications like wireless charging or motor control. Besides, switching losses are minimized with the

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