Summary of MELEXIS EXPANDS IMC-HALL® CURRENT SENSOR PORTFOLIO EXCEEDING MEASUREMENT
Melexis has launched the MLX91216 XHF, a high-current sensor using IMC-Hall® technology capable of measuring currents beyond 2000 A. Designed for automotive applications like battery-management systems, smart fuses, and traction inverters, it offers programmable filtering and built-in diagnostics such as broken-wire detection. Its SOIC8 surface-mount package with an Integrated Magnetic Concentrator simplifies installation and improves tolerance to mechanical movement compared to traditional Hall sensors. The sensor allows accurate, contact-free busbar current measurement with a U-shaped magnetic shield, avoiding the complexities of core-based sensor designs.
Parts used in the MLX91216 XHF Current Sensor project:
- MLX91216 XHF current sensor IC
- Integrated Magnetic Concentrator (IMC)
- SOIC8 surface-mount package
- U-shape magnetic shield
- PCB for sensor mounting
Melexis, a global microelectronics engineering company, has introduced the MLX91216 XHF extra high-field current sensor, extending the ease and accuracy of its unique IMC-Hall® technology into high-current measurement for emerging automotive applications.
Capable of measuring current to beyond 2000 A, the MLX91216 XHF is suited to redundant monitoring of battery-management systems (BMS), over-current detection in smart fuses, and measuring phase currents in traction inverters and boost/recuperation inverters. With user-programmable filtering to adjust resolution, response time, and bandwidth for optimum signal-to-noise ratio, the sensor features built-in diagnostics, including broken-wire detection.
The SOIC8 surface-mount device contains Melexis’ patented Integrated Magnetic Concentrator (IMC) that enables accurate contact-free measurement of busbar current in combination with a simple U-shape magnetic shield. When mounted on a PCB, the sensor is positioned over the busbar, within the shield, allowing easier assembly than conventional Hall sensors. What differentiates the proven IMC-Hall® technology from coreless solutions is that position is much less critical. The design can accept more mechanical movement because the measurement is not dependent on a magnetic field gradient. Other technologies that are can result in very severe bus bar machining causing important thermal hot spots. On the other hand, IMC-Hall® technology carries the advantages of coreless technologies, so it lends itself to smaller assemblies with surface mount package solutions. This avoids the use of more complex through-hole packages that often require specific lead bending/forming native to core-based solutions.
Read more: MELEXIS EXPANDS IMC-HALL® CURRENT SENSOR PORTFOLIO EXCEEDING MEASUREMENT
