Features Very High Toggle Rate: 280MHz Low Propagation Delay: 2.9ns Rail-to-Rail Inputs Extend Beyond Both Rails Output Current Capability: ±22mA Low Quiescent Current: 4.5mA Features within the LTC6752 Family: 2.45V to 5.25V Input Supply and 1.71V to 3.5V Output Supply (Separate Supply Option) 2.45V to 3.5V Supply (Single Supply Option) Shutdown Pin for Reduced Power Output […]
Intrinsyc’s new Open-Q 845 HDK Development Kit has the same Mini-ITX (170 x 170mm) dimensions and sandwich-style design as the Open-Q 835 from the previous year. The main SoC, Snapdragon 845 is integrated into the board topped by a heatsink. This dev board includes a smartphone like 5.7-inch QHD (1440 x 2560) touchscreen controlled via MIPI-DSI, as well as a camera board
OPEN-Q 845 HDK DEVELOPMENT BOARD INTEGRATES SNAPDRAGON 845 SOC AND RUNS ANDROID 8.0 Read More »
Description USB Power Delivery is a cool standard for getting lots of power—up to 100 W—from a USB Type-C port. Being an open standard for supplying enough power to charge phones, laptops, and just about anything else under the sun, USB PD is poised to greatly reduce the amount of e-waste produced worldwide from obsolete
F&S Elektronik Systeme has unveiled its latest Pico-ITX format (100 x 72mm) SBC named ArmStone™MX8M. This board is powered by the NXP i.MX processor. Preliminary shipping will not until Q2 of this year. The new ArmStone™MX8M is available with dual or quad-core variants of the 1.5GHz, Cortex-A53 i.MX8M. The SoC combines a Vivante GC7000Lite GPU and VPU, enabling 4K HEVC/H265, H264, and
NXP I.MX8M SOC POWERED ARMSTONE MX8M PICO-ITX SBC RUNS LINUX WITH 8GB LPDDR4 RAM Read More »
This project is a Mini Stereo Audio Amplifier based on TDA2822 IC. DESCRIPTION The dual low power amplifier built around TDA2822 8pin DIP. IC, it is mainly designed to use in portable players, radios and other building block project. A 3V supply can be used to drive headphones providing 20mW in 32 Ohms per channel, and a
Top-class calibrated humidity and temperature sensors Sensirion already gained many fans. Mainly thanks to a fact, that they´re not only “sensors” but a ready-made solution with a pre-amplifier, ADC and other circuits, which directly provide a final value in a digital form. That´s why it´s not necessary to solve input portion (noise, shielding, power supply,
Orlando Hoilett from Calvary Engineering LLC designed a versatile Li-Po battery breadboard power supply and wrote an Instructables on it. This power supply outputs 3.3V to the breadboard and takes input from a single-cell LiPo battery. The breadboard power supply also has the ability to charge the battery without needing to separate it from the circuit board. More importantly, this
Versatile And Open Source LiPo bBattery Breadboard Power Supply Read More »
Infineon adds GaN (Gallium Nitride) to its power portfolio: CoolGaN™ and GaN EiceDRIVER™ ICs. The next essential step towards an energy-efficient world lies in the use of new materials and technologies. Wide bandgap semiconductors enable greater power efficiency, smaller size, lighter weight, lower cost, or all together. Infineon is uniquely positioned in the power semiconductor
3.5″ Embedded SBC with Intel® Celeron® Processor J1900/J1800, LVDS, VGA, DisplayPort, Three GbE LANs and Audio. CAPA84R, is a fanless 3.5-inch embedded motherboard powered by the Intel® Celeron® processor J1900 quad-core or J1800 dual-core. The CPU is located at the rear side of the motherboard, which further aids the heat-extraction process and simplifies maintenance procedures. This fanless embedded board
CAPA84R – 3.5″ EMBEDDED SBC WITH INTEL® CELERON® PROCESSOR Read More »
IoT and mobile communications are targeted by the R&S NGL200 power supplies from Rohde & Schwarz. The architecture allows them to function both as a source and a sink, while short recovery times of 30 microseconds enable them to handle fast load changes that occur, for example, when a device switches from sleep mode to transmit mode.
