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NODEMCU ESP32 C3 RISC V BASED DEVELOPMENT BOARDS SUPPORTS WI FI AND BLE

NODEMCU ESP32-C3 RISC-V BASED DEVELOPMENT BOARDS, SUPPORTS WI-FI AND BLE

We recently saw that Ai-Thinker released modules that are based on the ESP32 MCU and support Wi-Fi and BLE 5.0 wireless connectivity. Ai-Thinker has been at the forefront in designing modules on the famous ESP microcontrollers by manufacturing the first series of modules on the ESP8266. Recently, CNX-Software spotted few development boards, integrating the Ai-Thinker modules on ESP32-C3. One of […]

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NANO 6063 THE LATEST NANO ITX EMBEDDED BOARD POWERED BY INTEL ATOMÂź X6000E SERIES PROCESSORS

NANO-6063, THE LATEST NANO-ITX EMBEDDED BOARD POWERED BY INTEL ATOMÂź X6000E SERIES PROCESSORS

NANO-6063 is Designed with 2.5GbE featuring Intel TSN/TCC Real-time Capability and -40°C to 85°C Wide operating Temperature for Industrial Automation, Healthcare Systems and Outdoor Gateway Application. Intel AtomŸ x6000E Series SoC based NANO-ITX Board with Triple Display, GbE LAN, USB 3.2 Gen 2, M.2, SATA III, Mini-PCIe, and mSATA American Portwell Technology, Inc., a wholly-owned

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MEET THE NEW 5G READY CARRIER BOARD FROM AAEONS UP BRIDGE THE GAP

MEET THE NEW 5G READY CARRIER BOARD FROM AAEON’S UP! BRIDGE THE GAP

Netherlands bands Embedded computing solutions manufacturer, AAEON Technology Europe, last week announced the launch of their latest carrier board; the UP Connect Plus, which was designed to add 5G capability to its popular UP Core Plus and UP Xtreme platforms. The UP Core Plus, an ultra-compact, high-performance, and fanless edge computing module, and the Up Xtreme, an even more powerful Edge

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OLIMEX STMP15X SOM AND STMP1A13 EVB EVAL BOARD BASED ON STM32MP1 SOC 1

OLIMEX STMP15X-SOM AND STMP1(A13)-EVB EVAL BOARD BASED ON STM32MP1 SOC

We saw several STM32MP1 SoC-based modules and SBCs entering the market in 2020. These include Ka-Ro Electronics’ QSMP module, Shiratech’s Stinger96 SBC, Exor Embedded NanoSOM nS02 module, and Octavo’s OSD32MP15x SiP module harnessing the functionalities of STM32MP1. Recently, Olimex unveiled the release of STMicroelectronics’ STM32MP1 SoC-based products, the STMP15X-SOM SoM, and the STMP1(A13)-EVB eval board. The STM32MP15X SoC features dual-core Arm Cortex-A7/M4 combined with an LCD interface, dedicated to

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AOI IN PCB PCBA MANUFACTURING PROCESS OF PCBGOGO

AOI IN PCB & PCBA MANUFACTURING PROCESS OF PCBGOGO

PCB assembly consists of many steps. For PCBs with through-hole components, the assembly is quite easy. But for SMT components, elements are placed on the conductive pads with previously applied solder paste that holds the SMT parts together. Then the components are soldered to the pads. Due to the ever-growing demand for high-density circuit boards

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MEET THE ALL NEW TINY ACOUSTIC DEVELOPMENT BOARD FOR 99.00

MEET THE ALL NEW TINY ACOUSTIC DEVELOPMENT BOARD FOR $99.00

When it comes to recording audio in wildlife or nature, you require something with a small form factor that does not harm the environment. There are several wildlife species that produce noise in ultrasonic frequencies like bats, moths, etc. Here comes the name for the credit card-sized open-source sound recording device â€œÎŒMoth” – designed to listen to audible

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COMPONENT CARRIERS REPLACE FLEXIBLE PRINTED CIRCUIT BOARDS IN LINEAR MEASURING SYSTEMS 1

COMPONENT CARRIERS REPLACE FLEXIBLE PRINTED CIRCUIT BOARDS IN LINEAR MEASURING SYSTEMS

HARTING has developed a component carrier that can be used directly with electronic components eliminating manual assembly and replacing flexible PCBs. Increasing precision and reducing assembly costs Component carriers are equipped with measuring sensors for detecting position The component carrier serves as a connecting element between a printed circuit board (PCB) and electronic components (such

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SIEMENS ACCELERATES DIGITAL MARKETPLACE STRATEGY WITH ACQUISITION OF SUPPLYFRAME FOR USD 0.7 BILLION

SIEMENS ACCELERATES DIGITAL MARKETPLACE STRATEGY WITH ACQUISITION OF SUPPLYFRAME FOR USD 0.7 BILLION

Siemens has signed an agreement to acquire Supplyframe, a leading Design-to-Source platform for the global electronics value chain, for USD 0.7 billion. The transaction unlocks significant value for customers of Supplyframe and Siemens, providing seamless and quick access to both Siemens’ offerings and Supplyframe’s marketplace intelligence. This will help customers to reduce costs, increase agility and make highly informed

SIEMENS ACCELERATES DIGITAL MARKETPLACE STRATEGY WITH ACQUISITION OF SUPPLYFRAME FOR USD 0.7 BILLION Read More »

LIFEPO4 CHARGER BOARD BASED ON CN3058E

LIFEPO4 CHARGER BOARD BASED ON CN3058E

LiFePO4 Batteries: An Overview Compact electronic devices rely on concise li-ion battery packs. Lithium iron phosphate battery (LiFEPO4) or LFP battery is a type of lithium-ion battery that uses lithium iron phosphate as a cathode and a graphitic carbon electrode as the anode. LFP batteries have a lower operating voltage and also present lower electrical

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EFABLESS LAUNCHES CHIPIGNITE WITH SKYWATER TO BRING CHIP CREATION TO THE MASSES

EFABLESS LAUNCHES CHIPIGNITE WITH SKYWATER TO BRING CHIP CREATION TO THE MASSES

Program includes a pre-designed carrier chip and automated open source design flow from Efabless SkyWater’s open source SKY130 process is the first node to be used to fabricate chips for the program Initiative removes access barriers by significantly reducing cost and the need for deep semiconductor experience to design chips Efabless, a community chip creation platform,

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