Advantech, a leading global provider of IoT systems and embedded platforms, is pleased to announce the latest 3.5″ SBC MIO-5393 powered by 9th Gen. Intel® Xeon®/Core™. Featuring a compact 146 x 102 mm (5.78 x 4.01 in) design, this single board computer offers impressive I/O functionality and domain-focused features like CANBus. Advantech’s embedded small form-factor SBC’s are designed to support wide operating temperature ranges (-40 ~ 85°C / -40 ~ 185°F) and harsh environments, making it an excellent choice for applications that require high processing speeds, such as Automated optical inspection machines, passenger information systems, outdoor kiosks, surveillance and medical devices.
High-performance Computing and Rapid NVMe Storage
Advantech’s platform is the first 3.5″ SBC to feature the latest 9th Gen. Intel® Xeon®/Core™ with six core computing power. This new generation SBC doubles USB speed by utilizing USB 3.2 Gen 2 (10Gbps). Using a built-in Gen9LP graphics engine, MIO-5393 supports three simultaneous displays with 48bit LVDS (eDP optional), HDMI (up to 4k@30Hz), and DisplayPort (up to 4k@60Hz). MIO-5393 supports up to 32GB(64GB*) memory size dual-channel DDR4 2400MHz and features a M.2 M-Key 2280 slot for NVMe/PCIE Gen3x4 high-speed PCIe SSD storage, providing high data rates for computing and storage. This makes the MIO-5393 an excellent solution for performance demanding applications that require computing power in a compact 3.5″ form-factor.
Innovative Thermal Design Supports Wide Operating Temperatures
Advantech’s MIO-5393 features the innovative Quadro Flow Cooling System (QFCS) thermal solution for excellent temperature management. This advanced high-efficiency low profile cooling solution facilitates extreme computing performance. This thin and light thermal solution features a silent fan, enabling heavy CPU loading without CPU speed throttling. MIO-5393 utilizes two different TDP (25W/45W) SKUs with either active or passive heatsink to support extended temperature operation (-40 ~ 85°C / -40 ~ 185°F). Advantech’s advanced thermal-solution leverages four symmetrical screw holes around the CPU to drastically reduce the thermal resistance and to dissipate the heat quickly. Advantech’s 3.5″ SBC effectively solves the temperature and thermal issues confronting outdoor kiosks, railway applications and factory environments.
Domain-Focused I/O Facilitates Flexible Expansion
MIO-5393’s built-in iManager 3.0 is based on Advantech’s EIO-201 embedded board management controller. iManager 3.0 integrates power sequence control to improve reliability and enable GPIO, hardware monitoring, smart fan control and watchdog timer functions. iManager 3.0 also supports domain-focused features like high-speed RS-232/422/485 up to 1Mbps, I²C (100kb/400kb/1Mb) and CANBus. MIO-5393 facilitates two M.2 expansions: E-Key for WiFi+BT wireless modules or AI acceleration cards, and a B-Key for 3G/LTE modules or SATA SSD’s (optional with M-key for high-speed NVMe/PCIex4 SSD’s). Additionally, Advantech’s MIOe extension interface provides 4x PCIe x1 / DDI / USB / LPC / SMBus connectivity for vertically-focused or customized expansion. For example, MIO-5393 supports Advantech’s MIOe-260 I/O expansion module and provides additional 2x GbE, 8x UART, 4x USB, 2x isolated CANBus, 1x miniPCIe socket and 1x M.2 B-key socket. This diverse and expansive I/O capacity is suitable for factory-based AGV or CNC automation and medical applications.
Read more: ADVANTECH INTRODUCES HIGH-PERFORMANCE 3.5″ SBC MIO-5393 WITH 9TH GEN. INTEL® XEON®/CORE™