Vertical Circuits and Asymtek Enable Next-Generation 3D Interconnect Technology : Companies Collaborate to Enable High-Volume Manufacturing of VCI’s 3D Vertical Interconnect Solutions
SCOTTS VALLEY, Calif. (PRWEB) July 15, 2008 Vertical Circuits’ patented vertical interconnect pillar (VIPTM) technology provides a low-cost alternative to existing wire bond and emerging through silicon via (TSV) interconnect solutions. The VIPTM solution enables IC manufacturers to deliver cost-effective stacked semiconductor die solutions that maximize the silicon density and minimize the package form factor. […]