Vertical Circuits and Asymtek Enable Next-Generation 3D Interconnect Technology : Companies Collaborate to Enable High-Volume Manufacturing of VCI’s 3D Vertical Interconnect Solutions


SCOTTS VALLEY, Calif. (PRWEB) July 15, 2008

Vertical Circuits’ patented vertical interconnect pillar (VIPTM) technology provides a low-cost alternative to existing wire bond and emerging through silicon via (TSV) interconnect solutions. The VIPTM solution enables IC manufacturers to deliver cost-effective stacked semiconductor die solutions that maximize the silicon density and minimize the package form factor. VCI’s VIPTM conductors are dispensed on the edge of the die stack utilizing Asymtek’s high speed, high accuracy jetting technology on the Axiom


About The Author

Ibrar Ayyub

I am an experienced technical writer holding a Master's degree in computer science from BZU Multan, Pakistan University. With a background spanning various industries, particularly in home automation and engineering, I have honed my skills in crafting clear and concise content. Proficient in leveraging infographics and diagrams, I strive to simplify complex concepts for readers. My strength lies in thorough research and presenting information in a structured and logical format.

Follow Us:
LinkedinTwitter

Leave a Comment

Your email address will not be published. Required fields are marked *

Scroll to Top