Vertical Circuits and Asymtek Enable Next-Generation 3D Interconnect Technology : Companies Collaborate to Enable High-Volume Manufacturing of VCI's 3D Vertical Interconnect Solutions

SCOTTS VALLEY, Calif. (PRWEB) July 15, 2008

Vertical Circuits’ patented vertical interconnect pillar (VIPTM) technology provides a low-cost alternative to existing wire bond and emerging through silicon via (TSV) interconnect solutions. The VIPTM solution enables IC manufacturers to deliver cost-effective stacked semiconductor die solutions that maximize the silicon density and minimize the package form factor. VCI’s VIPTM conductors are dispensed on the edge of the die stack utilizing Asymtek’s high speed, high accuracy jetting technology on the Axiom

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Ibrar Ayyub

Ibrar Ayyub is an experienced technical writer with a Master's degree in computer science from BZU Multan University. He has written for various industries, mainly home automation, and engineering. He has a clear and simple writing style and is skilled in using infographics and diagrams. He is a great researcher and is able to present information in a well-organized and logical manner.

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