SCOTTS VALLEY, Calif. (PRWEB) July 15, 2008
Vertical Circuits’ patented vertical interconnect pillar (VIPTM) technology provides a low-cost alternative to existing wire bond and emerging through silicon via (TSV) interconnect solutions. The VIPTM solution enables IC manufacturers to deliver cost-effective stacked semiconductor die solutions that maximize the silicon density and minimize the package form factor. VCI’s VIPTM conductors are dispensed on the edge of the die stack utilizing Asymtek’s high speed, high accuracy jetting technology on the Axiom