Interconnect

The Demand for Increased Functionality, Improved Signal Integrity and Interconnect Density is Driving the Requirement for Flexible and Flex-Rigid Substrates

Dublin (PRWEB) October 17, 2005 Research and Markets (http://www.researchandmarkets.com/reports/c25862) has announced the addition of Flexible and Flex-Rigid Printed Circuits 2005 – A Global Market and Technology Review 2004-2010 to their offering   This study provides a totally integrated assessment of the global flexible and flex-rigid substrate supply chain. Issues relating to technology, markets and strategic […]

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Mouser Electronics Inks Global Distribution Deal with Harwin, Inc. To Distribute High-reliability Interconnect Systems

Mansfield, TX (PRWEB) December 17, 2005 Mouser Electronics, Inc., the fastest growing electronics distributor in the industry, today announced it has reached a global distribution agreement with high-reliability interconnect systems manufacturer, Harwin, Inc.   Mouser will feature Harwins Datamate connectors, a professional range of 2mm pitch connectors suitable for any high-performance application. Small and rugged,

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Molexs Premo-Flex FFC Jumpers Now Available in a Wide Variety of Sizes to Provide Flexible Interconnect Between 2 PC Boards

(PRWEB) March 2, 2006 The new Flat Flex Cable Jumpers from Molex have been designed to provide high density interconnects in a wide variety of standard and custom lengths, as well as in different circuit sizes. The complete line of 0.50mm, 1.00mm and 1.25mm pitch Premo-Flex jumpers offers various sizes that can accommodate a flexible

Molexs Premo-Flex FFC Jumpers Now Available in a Wide Variety of Sizes to Provide Flexible Interconnect Between 2 PC Boards Read More »

Vertical Circuits and Asymtek Enable Next-Generation 3D Interconnect Technology : Companies Collaborate to Enable High-Volume Manufacturing of VCI’s 3D Vertical Interconnect Solutions

SCOTTS VALLEY, Calif. (PRWEB) July 15, 2008 Vertical Circuits’ patented vertical interconnect pillar (VIPTM) technology provides a low-cost alternative to existing wire bond and emerging through silicon via (TSV) interconnect solutions. The VIPTM solution enables IC manufacturers to deliver cost-effective stacked semiconductor die solutions that maximize the silicon density and minimize the package form factor.

Vertical Circuits and Asymtek Enable Next-Generation 3D Interconnect Technology : Companies Collaborate to Enable High-Volume Manufacturing of VCI’s 3D Vertical Interconnect Solutions Read More »

Electronic Interconnect Offers Medical Electronics, PCBs, Design Engineering

Chicago, IL (PRWEB) February 18, 2010 Electronic Interconnect (EI), a leading provider of printed circuit boards (PCBs) and PCB engineering and design services, announces the availability of specialized PCBs for medical device electronic assemblies and engineering and design services to help customers plan and develop medical electronic printed circuit assemblies.   According to Pratish Patel,

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Electronic Interconnect Offers PCBs for Photovoltaic (PV), Solar Applications

Chicago, IL (PRWEB) March 17, 2010 Electronic Interconnect (EI) offers Photovoltaic (PV) product manufacturers a widerange of printed circuit board materials, constructions, and PCB design expertise especially for high-power devices, LED, RF and Wireless electronic assemblies, including inverters and module assembly. These types of assemblies have special requirements for heat management characteristics, and this is

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Electronic Interconnect Offers SMT PCB Design and Manufacturing Services

Schaumburg, IL (PRWEB) May 28, 2010 Electronic Interconnect now offers a wide range of SMT PCB design and manufacturing services. “We have the capabilities to manufacture all types of Surface Mount printed circuit boards, not only 100% SMT, but also mixed technology boards, single-sided, double-sided, and in multiple layers”, says Pratish Patel. “Not only can

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Electronic Interconnect Offers DFM Service that Catches PCB Design Problems Up Front

Chicago, IL (PRWEB) August 31, 2010 Electronic Interconnect provides Design for Manufacturing (DFM) services automatically for new PCB orders, to detect, identify, and fix PCB design problems before they reach the prototype or production stage. This saves money for customers and prevents PCB manufacturing problems downstream, according to Shehryar Abbasi of EIs Engineering Department. EI

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Electronic Interconnect Granted UL Approval for New High Thermal Performance PCB Products

Chicago, IL (PRWEB) February 10, 2011 Electronic Interconnect (EI), a leading provider of printed circuit boards (PCBs) and PCB design services, has received Underwriters Laboratories (UL) approval to use 6-ounce copper and metal clad PCB components in PCB products and to apply the UL approval mark to them. EI received a UL Notice of Authorization

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Kinsus Interconnect Technology Corporation Selects Heidelberg Instruments to Support its Advanced Photomask Production

(PRWEB) September 10, 2011 Heidelberg Instruments, a leader in design, development and production of laser lithography systems, announced an order for a VPG 800 Maskless Lithography System from the Taiwan based Kinsus Interconnect Technology Corp . VPG 800 is an ideal for high volume production of todays demanding photomasks for various applications, including the advanced

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