Thermal

NEWSMAYS LATEST MINI PC IS BASED ON INTEL JASPER LAKE

NEWSMAY’S LATEST MINI PC IS BASED ON INTEL JASPER LAKE

With the interest in Mini-PC growing thanks to the growth being experienced across application feeds like Edge computing and Digital Displays, Intel at the beginning of the year announced the launch of the Jasper Lake processors to provide a more powerful processor for Mini PCs, and China-based mini-PC manufacturer, Newsmay technologies, has tapped up the processors in the new […]

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PARKER EXPANDS THERMAL INTERFACE MATERIALS OFFERING

PARKER EXPANDS THERMAL INTERFACE MATERIALS OFFERING

The Chomerics division of Parker Hannifin Corporation, the global leader in motion and control technologies, announced the launch of THERM-A-GAP GEL 75, a 7.5 W/m-K single component dispensable thermal interface material designed for high-performance applications. THERM-A-GAP GEL 75 is a single component, gel material best suited for today’s high-powered electronics applications. When applied to a heat-generating

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LITTELFUSE INTRODUCES 1 AMP FAULT PROTECTED SOLID STATE RELAY WITH INTEGRATED CURRENT LIMITING AND THERMAL SHUTDOWN

LITTELFUSE INTRODUCES 1 AMP FAULT PROTECTED SOLID STATE RELAY WITH INTEGRATED CURRENT LIMITING AND THERMAL SHUTDOWN

Littelfuse, Inc. a global manufacturer of leading technologies in circuit protection, power control, and sensing, announced the CPC1561B Solid State Relay (SSR). The CPC1561B is the highest current (1 A, 60 V) normally-open SSR currently available on the market to integrate both current limiting and thermal shutdown circuits. The small, surface-mount CPC1561B SSR’s dual fault

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PORTWELL RELEASES A SMALL AND COMPACT FANLESS EMBEDDED SYSTEM WITH 8TH GENERATION INTEL® CORE™ PROCESSOR

PORTWELL RELEASES A SMALL AND COMPACT FANLESS EMBEDDED SYSTEM WITH 8TH GENERATION INTEL® CORE™ PROCESSOR

WEBS-21G0 Is Rugged, Compact, Fan-less and Ideal for Digital Signage, Medical Equipment, IoT Edge, Communication and Industrial Automation and Control Applications American Portwell Technology, Inc., a world-leading innovator for Industrial PC (IPC) and embedded computing solutions, and a Titanium member of Intel Partner Alliance (https://www.portwell.com), announces the release of the WEBS-21G0, a fanless embedded system

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INTRODUCING TCAM MINI – AN IR THERMAL CAMERA BOARD WITH ESP32 MODULE

INTRODUCING TCAM-MINI – AN IR THERMAL CAMERA BOARD WITH ESP32 MODULE

tCam-Mini is a small wireless streaming thermal imaging camera designed by Dan Julio to make it easy to get and use radiometric data from a Flir Lepton 3.5 sensor. Radiometric data includes the temperature of every pixel captured by the Lepton allowing all kinds of interesting thermographic analysis. Of course that data can also be turned into the

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TCAM MINI RADIOMETRIC THERMAL IMAGING CAMERA WITH DESKTOP APP

TCAM-MINI RADIOMETRIC THERMAL IMAGING CAMERA WITH DESKTOP APP

We saw thermal imaging cameras for the evaluation of the hardware temperature of various devices. Open thermal camera is compatible with mobile phone applications for thermal imaging and FLIR ETS320 a non-contact thermal imaging camera solution for electronic testing are some of the examples. Talking more about thermal imaging, Dan Julio’s tCam-Mini is a radiometric camera for thermal imaging using

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ULN2003 – SEVEN DARLINGTON ARRAYS IN NEW TSSOP16 PACKAGE

ULN2003 – SEVEN DARLINGTON ARRAYS IN NEW TSSOP16 PACKAGE

The ULN2001, ULN2002, ULN2003 and ULN2004 are high-voltage, high-current Darlington arrays each containing seven open collector Darlington pairs with common emitters. Each channel is rated at 500 mA and can withstand peak currents of 600 mA. Suppression diodes are included for inductive load driving and the inputs are pinned opposite the outputs to simplify board

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IBASE UNVEILS 10TH GEN INTEL® CORE™ MINI ITX MOTHERBOARD

IBASE UNVEILS 10TH GEN INTEL® CORE™ MINI-ITX MOTHERBOARD

IBASE Technology Inc., a leading provider of embedded boards and solutions, unveils the release of its latest industrial-grade Mini-ITX motherboard – MI999. Based on Intel’s latest Q470E, H420E, and W480E chipsets, the board is designed to accommodate 10th Gen Intel® Core™ processors (codename Comet Lake-S) in an LGA 1200 package with a Thermal Design Power (TDP) of up

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HEILIND ELECTRONICS ADDS OMRONS D6T THERMAL SENSOR TO SENSOR PORTFOLIO

HEILIND ELECTRONICS ADDS OMRON’S D6T THERMAL SENSOR TO SENSOR PORTFOLIO

Heilind Electronics, a leading global distributor of electronic components and authorized distributor for Omron, has expanded its sensor offering with the Omron D6T MEMS thermal sensor. The sensor is designed for non-contact temperature measurement and human detection. Designed for target areas between minus 40 degrees and plus 200 degrees Celsius, the miniature D6T thermal sensor uses Omron’s

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TINY AUTOMOTIVE COMPLIANT 40V DUAL MOSFET BOASTS LOW RDSON RESISTANCE

TINY AUTOMOTIVE-COMPLIANT, 40V DUAL MOSFET BOASTS LOW RDS(ON) RESISTANCE

Diodes Incorporated introduced DMT47M2LDVQ automotive compliant 40V dual MOSFET in a 3.3mm x 3.3mm package for automotive systems. It smartly integrates two n-channel enhancement-mode MOSFETs with the lowest RDS(ON) (10.9mΩ at VGS of 10V and ID of 30.2A). The low on-resistance conduction helps in keeping the losses to a minimum in applications like wireless charging or motor control. Besides, switching losses are minimized with the

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