Technic Introduces New New High Speed Copper Eliminates Wafer Bowing

Cranston, Rhode Island (PRWEB) August 22, 2009

Technic Inc., an international leader in advanced electroplating process technology, has announced the release of Technic’s Semiplate Cu. Designed for Semiconductor plating applications where single sided copper electroplating of large areas is required, Semiplate Cu is a high speed copper plating process capable of depositing copper at 40 – 60 ASF with virtually no internal stress in the deposit. The deposit characteristics allow for coverage to a single side of the wafer without any undesirable bowing of the substrate. Technic Semiplate Cu removes the former limitations for large area copper plating on single sided wafers.

 

Andy Fioramonti, Technic’s Global Product Manager for Semiconductor Products, stated, “In this challenging global environment, Technic continues to invest in R&D and bring innovative solutions to market for our customers. Technic Semiplate Cu is an enabling technology that offers our customers a level of design flexibility not currently available in today’s market.”

 

Technic is a US based, private, financially strong corporation. For over 60 years, Technic has been a global supplier of proprietary chemistries, specialized custom finishing equipment, engineered powders, and analytical control systems to the electronic component, printed circuit board, semiconductor, photovoltaic, and industrial finishing industries.

 

Press Release Contact: Bob Sheeran

ads(at)technic(dot)com

(401) 721-2305

 

For information on Technic and Technic products go to: http://www.technic.com or contact Technic at (401) 781-6100.

 

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About The Author

Ibrar Ayyub

I am an experienced technical writer holding a Master's degree in computer science from BZU Multan, Pakistan University. With a background spanning various industries, particularly in home automation and engineering, I have honed my skills in crafting clear and concise content. Proficient in leveraging infographics and diagrams, I strive to simplify complex concepts for readers. My strength lies in thorough research and presenting information in a structured and logical format.

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