Technic Introduces New New High Speed Copper Eliminates Wafer Bowing
Cranston, Rhode Island (PRWEB) August 22, 2009 Technic Inc., an international leader in advanced electroplating process technology, has announced the release of Technic’s Semiplate Cu. Designed for Semiconductor plating applications where single sided copper electroplating of large areas is required, Semiplate Cu is a high speed copper plating process capable of depositing copper at 40 […]
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