Complementary TranSwitch and Octasic Semiconductor Devices Deliver High Density Voice Gateway Card
Shelton, CT and Montreal, QC (PRWEB) February 17, 2005
TranSwitch TEPro, Octasic OCT8304 and OCT6100 interface seamlessly in OEM design and field trials. TranSwitch® Corporation (NASDAQ: TXCC), and Octasic Semiconductor Inc. today announced an integrated solution for voice over packet (VoP) gateway implementations that allows OEMs to increase density and lower costs. Through the complementary fit and functionality of the TranSwitch TEProä, Octasic OCT8304 and OCT6100 devices, the two semiconductor vendors are able to implement a gateway’s voice plane functionality on a single card, using only three chips, resulting in a faster time to market for OEMs.
The companies also announced that a leading manufacturer of PON optical line terminals (OLT), used to enable fiber-to-the-premises (FTTP), has completed its design and field trials of a retrofittable DS3-rate high-density VoATM gateway using the TranSwitch/Octasic solution. TEPro has proven to be an ideal TDM network interface device for voice gateways, said Brian Stroehlein, product marketing manager for TranSwitch. By combining TEPro with Octasics voice over packet (VoP) and echo cancellation (EC) devices on a common H.110 bus, OEMs can rapidly implement high density VoP gateways.
The Octasic and TranSwitch devices are interconnected seamlessly with their common H.110 interfaces. Originally designed for cPCI applications incorporating a TDM backplane, H.110 is also usable as a device-to-device interconnect, enabling the full-duplex transfer of over 2,000 voice channels across one bus. Octasics devices combined with TranSwitchs TEPro greatly reduce time to market for equipment manufacturers due to the ease of integration, said Frederic Bourget, Octasics director product management. Together we provide an end-to-end solution from packet interfaces to Voice Processing to TDM.
TranSwitchs TEPro, a RISC processor-based device, integrates:
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