Santa Clara, CA (Vocus) April 24, 2009
A global leader in Integrated Passive Devices (IPD), OnChip today introduced a miniature Thin Film Silicon wire-bondable Resistor Chip that can offer a wide range of values. Using advanced thin-film manufacturing techniques and featuring high-stability, self-passivating and moisture-resistant Tantalum Nitride resistor elements, this product is ideal for developing quick-turn proto-types in the hybrid microelectronics labs. The multi-tapped 110R Series Resistors provide great flexiblity to hybrid circuit designers. Consisting of a string of 20 resistors, these chips can be wire-bonded to offer a wide range of resistances.
Measuring a size of 34 x 34 mils sq., the 110R consists of twenty one wire-bond pads. There are a set of 10 resistors with a value of 2.5k-ohms each and another set of 10 resistors with a value of 25k-ohms each, adding up to a total resistance of 275k-ohms. Since all these resistors are in series and with pads between each, the designer can get any values from 2.5k-ohms to 275k-ohms depending on what wire-bond pads are used. The 110R resistors offer TCR (Temperature Coefficient of Resistance) value as low as 250 ppm/