Speedline Technologies to Showcase Camalot Liquid Dispensing System, MPM AccuFlex Stencil Printing System at Nepcon Shenzhen 2005

SINGAPORE (PRWEB) August 4, 2005

August 4, 2005 – Speedline Technologies, the global leader for single-source process knowledge, solutions, and service to the PCB assembly and semiconductor packaging industries, will showcase its industry-leading dispensing and printing solutions and technologies at Nepcon Shenzhen 2005 in August.

Throughout the Exhibition, Speedline Technologies will host ongoing exhibits and demonstrations of its solutions in its booth, number 2C01. Highlighted systems will include:

The Camalot inline liquid dispensing system, designed for manufacturers with low-to-medium production requirements, this system is ideal for surface mount assembly (SMT) and hybrid applications, including glob top, solder paste, corner bond, gasketing and glue dotting functions.

Features include:

Fast and accurate dispensing, up to 13,000 dots per hour

Robust, reliable construction with welded steel frame and cast aluminum gantry supports

Easy use configuration for most surface mount assembly and semiconductor packaging applications

Camalot pump technology for excellent process control

The system utilizes lead screws and servo motors (with closed-loop encoders) on all three axes to assure smooth, precise, and accurate dispensing with an easy-to-use enhanced Graphic User Interface.

With a 0.9m x 0.9m (35.4in x 35.4inches) footprint, the inline 1414 has a dispensing area of 254mm x 254mm (10 x 10 inches). Available options include a touch-probe Z-axis sensor, hot plate and auto needle calibrator.

The MPM AccuFlex stencil printer, ideally suited for moderate volume high-mix printing at a cost-effective price, combines accuracy and unparalleled flexibility in a compact footprint. Providing only what is needed for efficient and precise printing, the AccuFlex offers electronics manufacturer a full range of options for future expansion. Designed for production of about 8,000 boards per week with two or more product changeovers per shift, the system easily handles boards from 3″ x 2″ to 23″ x 20″ and is capable of printing 12-mil pitch devices with consistent accuracy.

The MPM Gel-Flex™ Tooling System, an innovative and cost-effective answer to the challenge of supporting the circuit board during the stencil printing process. Consisting of non-conductive polyurethane elastomer gel enclosed within a durable membrane shell and mounted to a magnetic base, Gel-Flex tooling is a true conformal board-support system. The compressible gel material provides gentle compliance to delicate bottom-side components and leads while providing firm support for the entire board surface. The system is available for AccuFlex, AP Excel, Ultraprint 2000, and UltraFlex BBP printers. It is also available as an upgrade for those printers as well as the AP Series, Ultraprint 400 and Ultraprint 500 platforms.

For more information on Camalot Dispensing system, contact: Mr. Sam Ong, Speedline Product Business Manager, Camalot, Tel: 65-6488 9137, Fax: 65-6289 9411, Mobile: 65-9831 8308.

For more information on MPM Stencil Printing System and Gel-Flex Tooling System, contact: Mr. Kenneth Sim, Speedline Product Business Manager, MPM, Tel: 65-6488 9122, Fax: 65-6289 9411, Mobile: 65-9677 9097.

For local information, contact: Mr. Wei Feng, Business Manager, China, Mobile: 86-1390-190-3462 or Mr. Mole Chiu, Business Development Manager, South China, Taiwanese Accounts. Mobile: 86-1350-900-0510.

About Speedline Technologies

Speedline Technologies is the global leader in process knowledge and expertise for the PCB assembly and semiconductor industries. Based in Franklin, Massachusetts, U.S.A., the company markets five best-in-class brands — Accel microelectronics cleaning equipment; Camalot dispensing systems; Electrovert wave soldering, reflow soldering, and cleaning equipment; MPM stencil and screen printing systems; and Protect global services, support, and training solutions. Speedline Technologies is Frost & Sullivan’s “2005 Surface Mount Technology Company of the Year.”

Related Post

Be the first to comment

Leave a Reply

Your email address will not be published.


= 4 + 1

Read previous post:
Speedline Technologies’ Announces New Features to Enhance Lead-Free Capabilities of Econopak Gold Wave Soldering System

Franklin, MA (PRWEB) August 4, 2005 -– Speedline Technologies has announced the release of lead-free enhancements for its Electrovert® Econopak®...