Comlent and Agilent Team Up in RF Technology for Chinas Favorable 3G Standard, TD-SCDMA

SHANGHAI, China (PRWEB) March 20, 2006

Comlent Technology Inc., a fabless radio frequency integrated circuit (RFIC) design house and Agilent Technologies Co., Ltd., a global leader of RF EDA & Communications Testing Equipment, announced today that they have jointly established Comlent-Agilent TD-SCDMA Reference Lab (China).” This new lab has been oriented for the R&D, test and validation of RFIC, RF module and mobile terminal performance following TD-SCDMA, the third 3G international standard favored by China in addition to WCDMA and CDMA2000 that are respectively mostly deployed in Europe and US.


Comlent has selected Agilent’s RF and mixed-signal design software tools as its new benchmark for mobile communications RFIC development. Agilent’s RF Design Environment (RFDE) will provide Comlents designers with efficient circuit simulation and system design. This lab will help to accelerate the development and maturity of RF technology for Chinas TD-SCDMA chain, which may include but not limit to Comlents partners in both terminal and Base Band IC design. As the largest mobile handset market in the world, China has had 400 million mobile subscribers with a net growth of approximate 55 million per year during the past few years. Meanwhile, China has also been the worlds largest mobile phone manufacturer. In 2005, 268 million mobile handsets were made in China for both domestic and export markets, according to Chinas CCID under Ministry of Information Industry (MII).


As Chinas first proven RFIC design house with transceiver and power amplifier (PA) chips in mass production, Comlent, during the past three years, has invested over 10 million US dollars to establish a leading position in China. As part of the strategy, Comlent has built a most competitive technical team and powerful local marketing channels, as well as won strong government support in China, stated by Dr. Kai Chen, President and CEO of Comlent. Comlent will continue to intensify our investment to entrench our leading position in providing world-class IC technology, best support and quality service to local customers with a focus on Chinas specific markets such as TD-SCDMA for 3G mobile communications. Fastest time to market and penetration through win-win alliance and partnership, as demonstrated by this cooperation with the worlds leading RF EDA and testing equipment vendor Agilent, also contribute as one cornerstone of Comlents winning strategy.


Comlent Technology Inc. is a major developer of communications ICs in China, and a strong supporter of our RF Design Environment, said Howsiang Yap, Asia Regional manager, Agilent EEsof EDA Division. As Chinas 3G market starts growing up, we are glad to cooperate with Comlent, a famous local RFIC company, in building up the core competitive advantage our EDA solution and RFIC consulting service play a critical role in the overall development of RFICs, helping make mobile and wireless communication products designed more quickly and efficiently.


About Comlent:


Established in 2002, Comlent is Chinas first radio frequency integrated circuit (RFIC) design house. Its current major product line focuses on RF and mixed signal chips enabling wireless communication and key features for both mobile terminals and portable multi-media player (PMP) devices. For more information, please visit


About Agilent Technologies:


Agilent Technologies Inc. (NYSE: A) is the world’s premier measurement company and a technology leader in communications, electronics, life sciences and chemical analysis. The company’s 20,000 employees serve customers in more than 110 countries. In the fiscal year of 2005, Agilent achieved the net revenue of 5.1 billion US dollars. More information about Agilent is available on the Web at



About The Author

Ibrar Ayyub

I am an experienced technical writer holding a Master's degree in computer science from BZU Multan, Pakistan University. With a background spanning various industries, particularly in home automation and engineering, I have honed my skills in crafting clear and concise content. Proficient in leveraging infographics and diagrams, I strive to simplify complex concepts for readers. My strength lies in thorough research and presenting information in a structured and logical format.

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