Comlent

Comlent Commences Pilot Production of China’s First Complete RFIC Transceiver for Cellular Handset – Comlent Completes Entire Qualification Process for PHS Handset in Less than Eight Months

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Shanghai, China (PRWEB) May 16, 2005 Comlent, China’s first fabless radio-frequency integrated circuit (RFIC) design house headquartered in Shanghai Zhangjiang High-Tech Park, announced today that it has begun volume shipment of its CL3110 RFIC transceiver for the PHS/PAS handset market using Jazz Semiconductor’s RF process platform. With the shipment of its complete RF transceiver solution, […]

Comlent Commences Pilot Production of China’s First Complete RFIC Transceiver for Cellular Handset – Comlent Completes Entire Qualification Process for PHS Handset in Less than Eight Months Read More »

Comlent and Agilent Team Up in RF Technology for Chinas Favorable 3G Standard, TD-SCDMA

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SHANGHAI, China (PRWEB) March 20, 2006 Comlent Technology Inc., a fabless radio frequency integrated circuit (RFIC) design house and Agilent Technologies Co., Ltd., a global leader of RF EDA & Communications Testing Equipment, announced today that they have jointly established Comlent-Agilent TD-SCDMA Reference Lab (China).” This new lab has been oriented for the R&D, test

Comlent and Agilent Team Up in RF Technology for Chinas Favorable 3G Standard, TD-SCDMA Read More »

Domestic Chip Bottleneck Breakthrough Paves the Way for China’s 3G Launch – Comlent samples World’s 1st CMOS TD-SCDMA Transceiver

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SHANGHAI, China (PRWEB) October 30, 2006 Comlent Technology Inc., the only Radio Frequency Integrated Circuit (RFIC) corporate member of China’s 3G standard TD-SCDMA Industry Alliance (TDIA), announced today that it starts sampling RFIC transceiver and analog baseband (ABB) chipset in advanced CMOS technology for TD-SCDMA, the world’s first in its kind.   The chipset includes

Domestic Chip Bottleneck Breakthrough Paves the Way for China’s 3G Launch – Comlent samples World’s 1st CMOS TD-SCDMA Transceiver Read More »

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