IMAPS Honors IC Insights with a GBC Partnership Award

Washington, DC (PRWEB) February 15, 2011

The International Microelectronics And Packaging Society (IMAPS) announced that IC Insights will receive a new award from IMAPS Global Business Council named the GBC Partnership Award.

The GBC Partnership Award recognizes corporations that invest their time and talent in helping IMAPS execute on the societys mission to lead the Microelectronics Packaging, Interconnect and Assembly Community, providing means of communicating, educating, and interacting at a global level for the business issues the industry faces. The award will be presented Thursday, February 17th to Bill McClean, President of IC Insights following his talk on Reasons for Optimism in 2011 at the IMAPS Arizona Chapter luncheon held in Tempe.

IC Insights has delivered timely keynote addresses at our first quarter Global Business Council and AZ Chapter meetings the past two years. Their ability to communicate key industry trends and provide accurate semiconductor market forecasts during this period of volatility has helped our members better understand the diverse semiconductor market and business cycles. We feel our GBC attendees will get great insight from their luncheon keynote on March 7th that helps bridge a very strong program on the eras of 3D and energy efficiency, stated Lee Smith of Amkor who serves as VP of Marketing and Membership for IMAPS along with his role as the GBC 3D packaging co-chair.

The IMAPS events have allowed IC Insights to communicate our outlook and hear the growth perspectives from decision makers across the semiconductor supply chain. Confidence established in the first and second quarters, was a key reason the industry was able to respond quickly to the strong rebound in the second half of 2009 and carry that through the first three quarters of 2010 to give us a boom year that met our aggressive expectations. So it is an honor to be recognized and invited to continue participating in these important IMAPS events, noted Bill McClean.

Note: Monday March 7th, Brian Matas VP of Market Research at IC Insights will deliver the keynote address at the Global Business Councils Spring 2011 event held at the Radisson Fort McDowell Resort in Fountain Hills, AZ. The GBC event precedes the IMAPS Device Packaging Conference that runs through Thursday, March 10th.

About IMAPS – The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Societys portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.

About IC Insights, Inc. – IC Insights, Inc. is a leading semiconductor market research company headquartered in Scottsdale, Arizona, USA. Founded in 1997, IC Insights offers complete analysis of the integrated circuit (IC), optoelectronic, sensor/actuator, and discrete semiconductor markets with coverage including current business, economic, and technology trends, the impact of new products on the market, top supplier rankings, capital spending and wafer capacity trends, the impact of new semiconductor products on the market, and other relevant semiconductor industry information.


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Ibrar Ayyub

Ibrar Ayyub is an experienced technical writer with a Master's degree in computer science from BZU Multan University. He has written for various industries, mainly home automation, and engineering. He has a clear and simple writing style and is skilled in using infographics and diagrams. He is a great researcher and is able to present information in a well-organized and logical manner.

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