Japan’s Embedded Technology 2011 Trade Show Agrees to Co-Locate With Major EDA Conference

Yokohama, Japan (PRWEB) July 31, 2011

Japan Embedded Systems Technology Association (JASA) with the participation of industry leaders in Japan will be holding its annual Embedded Technology Conference and Exhibition (ET2011) in Yokohama, Japan, November 16 through 18, 2011. Last year, approximately 22,000 registered attendees visited ET2010, the largest embedded technology event in the world. The event offers suppliers a cost-effective and efficient exhibition – opening a window to Japan and Asia markets for embedded products and services. Special turnkey booth and support services are offered for emerging ventures and startups.

 

An exciting benefit for ET exhibitors in 2011 is that JASA has made an agreement with Japan Electronics and Information Technology Industries Association (JEITA) to co-locate EDSF with ET2011 at the Pacifico Yokohama exhibition center on the same dates as the ET show. Electronic Design and Solution Fair (EDSF) is the Japanese version of the Design Automation Conference (DAC) held in the USA. This expanded visitor and prospect base will present a good opportunity to promote products to SoC and system level designers in Japan and Asia.

 

Featuring a comprehensive technical program, including in-depth tutorials and tomorrow’s application themes, ET2011 provides a unique opportunity for design engineers and managers to grasp the advanced techniques that address programming and real-time design challenges. Attendees will be able to test the latest embedded hardware, semiconductors/integrated circuits, design tools, middleware, and many other products from more than 350 exhibitors (750+ booths), including Intel, Microsoft, ARM, Texas Instruments, NEC, Panasonic, STMicroelectronics, Fujitsu, Xilinx, Mentor Graphics, Renesas Electronics, Altera, NXP Semiconductors, IBM and Synopsys that were all ET2010 exhibitors.

 

ET 2011’s 100+ conference sessions will be attended by more than 10,000 registered attendees. The sessions will address today’s hottest design topics, including multicore processors, 28nm FPGA, the Android platform, smart energy technologies, dependable systems, formal verification, real-time design and testing strategies and tools for complex embedded systems. The sessions will enable design engineers to obtain the latest embedded know-how needed to create state-of-the-art design solutions.

 

ET2011 will spotlight hot applications in Japan covering digital consumer, automotive electronics, ubiquitous computing/communication and factory automation/robotics. The emergence of advanced processors, better development tools, and high-speed Internet access has created a plethora of opportunities for consumer electronics products that combine audio and video technologies.

 

A turnkey booth package is available for both 1-unit (3x3m) booth and 2-unit (3x6m) booth configurations. The cost for a basic 1-booth set up is 90,000 yen plus tax. The cost for a basic 2-booth set up is 130,000 yen plus tax. Turnkey booths includes basic carpet/flooring, lights/furnishings and electrical. The turnkey booth is set up for exhibitors…just have to add your signs, brochures and other items you wish to bring.

 

Registration for attendees is free with pre-registration. ET2011 is offering conference exhibitors attractive booth packages and an array of optional services. Exhibitors can take advantage of special services, such as turnkey booths, suite rooms, workshops, open-stage presentations, show promotions, and the Venture Village Pavilion. For details on exhibiting at this premiere event, visit http://www.embeddedtech.net or contact Steve Szirom: Tel: (360) 676-2260; E-mail: sszirom(at)insidechips(dot)com, the North American exhibitor representative for this event.

 

###


Find More Electronic Circuits Press Releases


About The Author

Ibrar Ayyub

I am an experienced technical writer holding a Master's degree in computer science from BZU Multan, Pakistan University. With a background spanning various industries, particularly in home automation and engineering, I have honed my skills in crafting clear and concise content. Proficient in leveraging infographics and diagrams, I strive to simplify complex concepts for readers. My strength lies in thorough research and presenting information in a structured and logical format.

Follow Us:
LinkedinTwitter

Leave a Comment

Your email address will not be published. Required fields are marked *

Scroll to Top