STMicroelectronics VL53L5 FlightSense™ Time-of-Flight Mini Depth Camera integrates a SPAD array, physical infrared filters, and diffractive optics (DOE) in a miniature reflowable package. These features allow the VL53L5 to achieve the best ranging performance in various ambient lighting conditions with various cover glass materials. The use of a DOE above the vertical-cavity surface-emitting laser (VCSEL) allows a square FoV to be projected onto the scene. The receiver lens focuses the reflection of this light onto a SPAD array.

The STM VL53L5 FlightSense Time-of-Flight Mini Depth Camera utilizes a direct ToF technology that allows absolute distance measurement, whatever the target color and reflectance. The ToF technology provides accurate ranging up to 400cm, and the 32bit MCU with extra HW accelerator can post-process the histogram and stream ready-to-use depth information at fast speeds (60Hz).


  • Fully integrated miniature module
    • Emitter: 940nm invisible vertical cavity surface emitting laser (VCSEL) and integrated analog driver
    • 61° diagonal square system field of view (FoV) using diffractive optical elements (DOE) on both transmitter and receiver
    • Receiving array of single photon avalanche diodes (SPADs) in both transmitter and receiver apertures
    • Low-power microcontroller running firmware
    • 6.4mm x 3.0mm x 1.5mm Size
  • Fast, accurate distance ranging
    • Parallel multi zone output; either 4×4 or 8×8 separate regions of interest (ROI)
    • Up to 400cm ranging
    • 60Hz frame rate capability
    • Histogram processing and algorithmic compensation minimizes or removes impact of cover glass crosstalk
    • Fully autonomous device with on-board histogram and ranging processing running on ST in-house 32Bit MCU
    • Dynamic crosstalk compensation for fingerprint smudge via latest patented ToF techniques
  • Easy integration
    • Flexible power supply options, single 3.3V or 2.8V operation or combination of either 3.3V or 2.8V AVDD with 1.8V IOVDD
    • Compatible with wide range of cover glass materials
    • I²C or SPI interface
    • Low-power pin and two general purpose inputs (GPIOs) for interrupt and synchronization
    • Full set of software drivers (Linux and Android compatible) for turnkey


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