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RECORD SMASHING SNAPMAKER 2.0 3D PRINTERS NOW AVAILABLE FOR WEBSITE PRE ORDERS

SNAPMAKER 2.0 3D PRINTER: FASTEST EVER PROJECT TO REACH $1M ON KICKSTARTER!

Snapmaker, the 3D printer brand that had the second most funded and fulfilled 3D printing campaign on Kickstarter, has secured another crowdfunding success with the launch of the Snapmaker 2.0. Having raised over $2M in only an hour on Kickstarter, the Snapmaker 2.0 is the latest generation of 3-in-1 3D printers from Snapmaker. Available in 3 models

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WORLD’S FIRST CONSUMER 3D CHOCO PRINTER STARTING AT 198 €

WORLD’S FIRST CONSUMER 3D CHOCO PRINTER STARTING AT 198 €

It’s not just another 3D printer – it is all about Choco, edible and incredibly fancy, if you make your own Choco objects with mycusini – the first consumer 3D Choco printer coming up on Kickstarter. Create 3D Choco give-aways for your loved ones or the Choco highlight on your dessert. Easily filled with delicious

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EPIC KBS9 PUC PROVEN PERFORMANCE FOR YOUR EMBEDDED APPLICATION

EPIC-KBS9-PUC: PROVEN PERFORMANCE FOR YOUR EMBEDDED APPLICATION

AAEON, an industry leader in embedded computing systems, announces the EPIC-KBS9-PUC barebones embedded system. Built upon our success and knowledge, the EPIC-KBS9-PUC offers the power of 6th and 7th Generation Intel Core Processors, four Gigabit Ethernet ports, and a range of expandability and customization to support your application. The EPIC-KBS9-PUC is a barebones system based on our

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SMALL FORM FACTOR BOARD HAS COMPUTING POWER FOR MEDICAL AND IOT

SMALL FORM FACTOR BOARD HAS COMPUTING POWER FOR MEDICAL AND IOT

Populated with the Intel Core i5 7300U and i3 7100U processors, the WUX-7x00U is a small form factor (SFF) embedded board by Portwell. The processors, formerly codenamed Kaby Lake, integrate the low power Intel Gen. 9.5 HD Graphics, 620 graphics engine with 24 execution units, enabling enhanced 3D graphics performance and higher speed for 4K encode and

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LG AND INFINEON TO INTRODUCE LG G8THINQ WITH FRONT FACING TIME OF FLIGHT CAMERA

LG AND INFINEON TO INTRODUCE LG G8THINQ WITH FRONT-FACING TIME-OF-FLIGHT CAMERA

With Infineon’s REAL3™ Image Sensor Chip, LG Offers Enhanced Security and Depth Measuring Selfie Camera LG Electronics and Infineon Technologies AG have teamed up to introduce leading edge Time-of-Flight (ToF) technology to smartphone selfie photo lovers world over. Infineon’s REAL3™ image sensor chip will play a key role in the front-facing camera of the upcoming LG G8 ThinQ, to be unveiled

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SLIMLINE NVME SSD OUTPERFORMS SATA MODELS

SLIMLINE NVME SSD OUTPERFORMS SATA MODELS

Western Digital Corp. , a global data infrastructure leader, is accelerating the NVMe transition of value-PC storage by adding an NVMe™ model to its award-winning WD Blue® solid state drive (SSD) portfolio, the WD Blue SN500 NVMe SSD. The new SSD delivers three-times the performance of its SATA counterpart1 while maintaining the reliability the WD Blue product line

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TDK CLAIMS SMALLEST POINT OF LOAD DC DC CONVERTER

TDK CLAIMS SMALLEST POINT-OF-LOAD DC-DC CONVERTER

µPOL DC-DC converters bring highest power density to space-constrained apps TDK Corporation announces the new series of µPOL™ DC-DC converters, the industry’s most compact and highest power density point-of-load solutions for applications such as big data, machine learning, artificial intelligence (AI), 5G cells, IoT and computing enterprise. Rather than using side by side discrete integrated circuit

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