3d

3D SILICON INTEGRATED MICROCAPACITORS HAVE UNPRECEDENTED PERFORMANCE

3D SILICON-INTEGRATED MICROCAPACITORS HAVE UNPRECEDENTED PERFORMANCE

Picosun Group, global provider of leading AGILE ALD® (Atomic Layer Deposition) thin film coating solutions, reports record performance of silicon-integrated, three-dimensional deep trench microcapacitors manufactured using its ALD technology. Increasing efficiency and performance demands of portable and wearable electronics, along with their shrinking size in accordance with the Moore’s law, set new challenges to the power

3D SILICON-INTEGRATED MICROCAPACITORS HAVE UNPRECEDENTED PERFORMANCE Read More »

3D IMAGE SENSOR REAL3 FOR FACE AUTHENTICATION ANNOUNCED AT CES 2020

3D IMAGE SENSOR REAL3 FOR FACE AUTHENTICATION ANNOUNCED AT CES 2020

Infineon Technologies AG has collaborated with software and 3D Time-of-Flight (ToF) system specialist pmdtechnologies ag to develop reportedly the world’s smallest, most powerful 3D image sensor. Designated the REAL3, the single-chip solution measures just 4.4 x 5.1 mm and is the fifth generation of time-of-flight deep sensors from Infineon. The sensor can be incorporated into even the smallest devices with just

3D IMAGE SENSOR REAL3 FOR FACE AUTHENTICATION ANNOUNCED AT CES 2020 Read More »

3D Printed Ethernet Telescope

3D Printed Ethernet Telescope

I’ve seen PiKon. it’s great. i want make it. not original but add function!! so I made Ethernet Telescope. it’s Project name is WIZKon Telescope !! : ) Step 1: Prepare Material Need these… 3D cad file : i published below site -> Link mbed : i use WIZwiki-W7500 or WIZwiki-W7500ECO -> Link Serial Camera : i use LJ-DSC02, found this site -> Link

3D Printed Ethernet Telescope Read More »

SAMSUNG UNVEILS 12 LAYER 3D TSV CHIP PACKAGING TECHNOLOGY

SAMSUNG UNVEILS 12-LAYER 3D-TSV CHIP PACKAGING TECHNOLOGY

An industry’s first, the 12-layer 3D-TSV (Through Silicon Via) technology developed by Samsung Electronics enables the stacking of 12 DRAM chips using more than 60,000 TSV holes, while maintaining the same thickness as current 8-layer chips. By Julien Happich @ eenewseurope.com Developed for the mass production of high-performance chips, the layered packaging technology requires pinpoint accuracy

SAMSUNG UNVEILS 12-LAYER 3D-TSV CHIP PACKAGING TECHNOLOGY Read More »

IoT Scale

IoT Scale

In this Instructable we will make an IoT scale! You might ask: “What in the world do I need an IoT scale for?”, and that is a good question! In truth, you probably don’t need one but you also don’t need a Tesla but you’d get one if you could 😛 But in all seriousness,

IoT Scale Read More »

E CON SYSTEMS LAUNCHES FSCAM CU135 – THE LATEST 4K MULTI FRAME BUFFER USB CAMERA

E-CON SYSTEMS LAUNCHES FSCAM_CU135 – THE LATEST 4K MULTI FRAME BUFFER USB CAMERA

e-con Systems Inc., a leading embedded camera solution provider company, today launched the FRAMEsafe, a new family of USB UVC Cameras with internal buffer that ensures reliable transfer of images over USB interface. Powered by e-con’s proprietary FloControl technology, FRAMEsafe cameras support on-demand image capture capability which can be controlled from the host application. The effective decoupling

E-CON SYSTEMS LAUNCHES FSCAM_CU135 – THE LATEST 4K MULTI FRAME BUFFER USB CAMERA Read More »

SEPTENTRIO STRENGTHENS ITS GNSS INS PORTFOLIO WITH A SINGLE ANTENNA RECEIVER

SEPTENTRIO STRENGTHENS ITS GNSS/INS PORTFOLIO WITH A SINGLE ANTENNA RECEIVER

High-precision GPS/INS receiver is now available with a single antenna for faster integration, lighter weight and lower power consumption. High-precision GPS/INS receiver is now available with a single antenna option for faster integration, lighter weight and lower power consumption. Septentrio, a leader in high-precision positioning technology, announced today that their GPS/INS receiver is now available

SEPTENTRIO STRENGTHENS ITS GNSS/INS PORTFOLIO WITH A SINGLE ANTENNA RECEIVER Read More »

NEW KEYENCE VHX 7000 4K MICROSCOPE ENHANCES VIEW CAPTURE AND MEASURE TASKS

NEW KEYENCE VHX-7000 4K MICROSCOPE ENHANCES VIEW, CAPTURE AND MEASURE TASKS

The VHX-7000 digital microscope, which is now available in the UK and Ireland, offers high magnification and accuracy, and is both versatile and easy to use. With a wide array of functions and features, the VHX-7000 is the best way to future-proof microscopy requirements for years to come. Using the Keyence VHX-7000, both 2D and 3D measurements

NEW KEYENCE VHX-7000 4K MICROSCOPE ENHANCES VIEW, CAPTURE AND MEASURE TASKS Read More »

Scroll to Top