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HARTING EUROPE COMPONENT CARRIER NOW REPLACING FLEXIBLE PCBS

HARTING EUROPE, COMPONENT CARRIER NOW REPLACING FLEXIBLE PCBS

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Flexible circuit boards offer numerous advantages. However, the mechanical fixation of these circuit boards is highly complex. HARTING has developed a new solution based on 3D-MID technology that is capable of replacing flexible circuit boards. Thanks to component carriers, cost savings of up to two-thirds can be achieved. At the MID process, on the injection […]

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TIG ANNOUNCES BLUETERA II OPEN SOURCE IOT MOTION BASED DEVELOPMENT BOARD

TIG ANNOUNCES BLUETERA II OPEN SOURCE IOT MOTION-BASED DEVELOPMENT BOARD

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Tensor Iotera Group (TIG) has announced its new Bluetera II open source full-stack development board, which according to the company uses Google’s Protocol Buffer technology for motion-based IoT applications. TIG says that the Bluetera II is the second generation module. Bluetera II is built to fill the gap for an open source platform that meets the following requirements : A system-level API that properly

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CALTECH’S LOW COST SWEAT SENSOR TRACKS STRESS THROUGH CORTISOL LEVELS

CALTECH’S LOW-COST SWEAT SENSOR TRACKS STRESS THROUGH CORTISOL LEVELS

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From tracking diabetes to the detection of diseases like Cystic Fibrosis, a lot of ideas around monitoring/analyzing human sweat, as a non-invasive method of detecting or monitoring diseases has been around for a while. Leveraging on this idea, a team of researchers at Caltech, led by Wei Gao, assistant professor of medical engineering at Caltech, has created a wireless, non-invasive,

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UNLEASH A WORLD OF SMART POSSIBILITIES WITH IWAVE AND CRANK

UNLEASH A WORLD OF SMART POSSIBILITIES WITH IWAVE AND CRANK

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iWave Systems, a global leader in embedded system and cutting edge solutions, has partnered with Crank Software Inc., to support vibrant and rich graphics representation on the powerful i.MX 8 series System on Modules and SBC boards. Powered by the NXP i.MX8 application processors, the SOM and SBC are optimized for sophisticated real-time computing in embedded applications,

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BLUETERA II – FULL STACK DEV BOARD THAT USES PROTOCOL BUFFERS FOR MOTION BASED IOT APPLICATIONS

BLUETERA II – FULL-STACK DEV BOARD THAT USES PROTOCOL BUFFERS FOR MOTION-BASED IOT APPLICATIONS

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Many of our clients face a common challenge when undertaking IoT projects. They are experts in their own fields, and most of of them have a great idea, a proof-of-concept (PoC), or a sophisticated algorithm that addresses some specific need. They have simulated their solution in Matlab or Python and are eager to build and

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OSM OPEN STANDARD MODULE WITH NXP I.MX 8M MINI NANO CPU

OSM (OPEN STANDARD MODULE) WITH NXP I.MX 8M MINI / NANO CPU

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F&S Elektronik Systeme GmbH presents a prototype of a direct solder module.  It’a a 30 x 30mm “OSM-MX8MM” module that runs Linux on an i.MX8M Mini. As part of the SGET, the standardization group SDT.05 was founded jointly by iesy GmbH, F&S Elektronik Systeme GmbH and Kontron AG. The aim of this group is a new standard

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KIOXIA UNVEILS FIFTH GENERATION BICS FLASH

KIOXIA UNVEILS FIFTH-GENERATION BICS FLASH

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New generation 3D flash memory adds layers, boosts capacity, broader bandwidth and provides new design flexibility KIOXIA Europe GmbH, the world leader in memory solutions, today announced that it has successfully developed its fifth-generation BiCS FLASH three-dimensional (3D) flash memory with a 112-layer vertically stacked structure. KIOXIA plans to start shipping samples of the new device, which has a

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SEEED’S ODYSSEY – STM32MP157C SBC FEATURES CORTEX A7 AND M4 PROCESSOR

SEEED’S ODYSSEY – STM32MP157C SBC FEATURES CORTEX-A7 AND M4 PROCESSOR

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Odyssey-STM32MP157C  joins τηε growing list of SBCσ developed by SeeedStudio. It comprises a baseboard device called the NPi-STM32MP157C and an SoM device based on an STMicroelectronics’ Arm Cortex A7/M4 hybrid SoC called the SOM-STM32MP157C. SeeedStudio explains that it’s choice of the Cortex-A7 processor comes from it being a very energy efficient applications processor as it was designed to provide

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RESEARCHERS EXPAND MICROCHIP CAPABILITY WITH NEW 3D INDUCTOR TECHNOLOGY

RESEARCHERS EXPAND MICROCHIP CAPABILITY WITH NEW 3D INDUCTOR TECHNOLOGY

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Smaller is better when it comes to microchips, researchers said, and by using 3D components on a standardized 2D microchip manufacturing platform, developers can use up to 100 times less chip space. A team of engineers has boosted the performance of its previously developed 3D inductor technology by adding as much as three orders of

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