Introduces

OnChip Introduces Thin Film Precision Silicon Chip Resistors for Hi-Rel Applications

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Santa Clara, CA (Vocus) February 4, 2009 A global leader in Integrated Passives Devices (IPD), OnChip today introduced a family of Thin Film Silicon wire-bondable Resistor Chips. These products use sophisticated thin-film manufacturing process featuring a high-stability, self-passivating and moisture-resistant Tantalum Nitride resistor element. Consisting of a single and dual value resistors, these chips offer […]

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OnChip Devices Introduces Low Capacitance Diode Arrays for RF Antenna ESD Protection

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Santa Clara, CA (Vocus) March 3, 2009 OnChip Devices, a world leader in Integrated Passive Devices (IPD), has introduced a miniature diode array with very low input capacitance and high protection levels from electrostatic discharge (ESD) of RF Antenna circuit. Wireless devices can be susceptible to ESD events through the Antenna. The ESD pulse can

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OnChip Introduces Thin Film Multi-tapped Silicon Chip Resistors for Hi-Rel Applications

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Santa Clara, CA (Vocus) April 24, 2009 A global leader in Integrated Passive Devices (IPD), OnChip today introduced a miniature Thin Film Silicon wire-bondable Resistor Chip that can offer a wide range of values. Using advanced thin-film manufacturing techniques and featuring high-stability, self-passivating and moisture-resistant Tantalum Nitride resistor elements, this product is ideal for developing

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Equalis Introduces Powerful Instrument Control and Fixed Point Modules

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San Jose, CA (PRWEB) January 17, 2012 Equalis, the leading provider of open source numerical analysis, visualization and simulation solutions for engineers and scientists, built on the Scilab open source numerical computation platform, today announced the availability of its Instrument Control module and Fixed Point module. These powerful new capabilities are provided through the Equalis

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Scala Introduces New Consumer Device Controlled Screen Communication Solution at ISE 2012

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Exton, Pa. (PRWEB) January 18, 2012 Visitors of Integrated Systems Europe 2012 can experience and test Scalas latest development: a new interactive screen communication solution that can be managed through a variety of consumer devices, such as a smart phone, iPad or tablet PC. By scanning a QR code with their smart phone at Scalas

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Technic Introduces New New High Speed Copper Eliminates Wafer Bowing

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Cranston, Rhode Island (PRWEB) August 22, 2009 Technic Inc., an international leader in advanced electroplating process technology, has announced the release of Technic’s Semiplate Cu. Designed for Semiconductor plating applications where single sided copper electroplating of large areas is required, Semiplate Cu is a high speed copper plating process capable of depositing copper at 40

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Heraeus Introduces Versatile New Front Side Silver Paste for Silicon PV Cells

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West Conshohocken, PA (PRWEB) September 17, 2009 The Photovoltaic Business Unit of Heraeus has developed a new front-side silver paste that offers higher efficiencies along with superior contact quality and aspect ratios on both mono- and multi-crystalline wafers and a wide range of sheet resistance emitters. The cadmium-free silver metallization paste (SOL9235H) is the newest

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Fujitsu introduces 32Mbit page-mode Flash memories with industry-first 32-bit data transfer and 20ns read time

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(PRWEB) October 20, 2000 London, October 18 2000 – Fujitsu Microelectronics Europe has announced a 32Mbit page-mode Flash memory family with 32-bit data transfer and a high speed read time of just 20ns.   Jointly developed with Fujitsu’s collaborative partner Advanced Micro Devices (AMD), the new MBM29PL3200 series are the first devices of their type

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Fujitsu Introduces Enhanced Low Power Version of 16Mbit High Density RAM for Next Generation Mobile Phone Applications

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(PRWEB) December 9, 2000 Second generation 16Mbit High Density RAM, Based on Fujitsu’s FCRAM Architecture, Reduces Power Requirements and Enhances Refresh-Free Operation   December 6 2000 – Fujitsu Microelectronics Europe has introduced the industry’s newest Application Specific Memory (ASM), a second generation 16Mbit RAM with enhanced power requirements as low as 70 microamps.   Fujitsu’s

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Fujitsu Microelectronics Europe introduces 16-bit MCU with triple CAN interfaces

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(PRWEB) October 27, 2001 London, October 25 2001 – Fujitsu Microelectronics Europe’s new MB90F443G microcontroller, which integrates three CAN interfaces, is the latest member of Fujitsu’s 16-bit CAN controller family with on-chip Flash memory, designed at the company’s European Microcontroller Design Centre.   The CAN interface of the MB90F443G conforms to CAN specification version 2.0

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