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HDP User Group International Publishes Halogen-Free Guideline for Electronics Products

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Scottsdale, AZ (PRWEB) November 12, 2008 The High Density Packaging User Group International, Inc. (HDP User Group), a global non-profit cooperative research and development organization for the Electronics Manufacturing industries, announced the publication of the “Halogen-Free Guideline”, a first of a kind document that was developed over a 15 month period by 25 contributing companies […]

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CA Releases Internet Security Suite Plus 2009 : New Feature-Rich Suite Includes Enhanced Malware Protection, Easy-to-Use Parental Control, Robust Customer Support and Reduced User Interruptions Backed by Internet Protection Plan with Coverage up to $10,000

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ISLANDIA, N.Y. (PRWEB) November 24, 2008 In addition to the enhanced security features, the suite is now more user-friendly through its inclusion of an Intuitive Help Desk for at-your-fingertips customer support, a simple interface that lets users quickly set preferences or check program status, and a gaming/movie mode to reduce interruptions. With tailored security options

CA Releases Internet Security Suite Plus 2009 : New Feature-Rich Suite Includes Enhanced Malware Protection, Easy-to-Use Parental Control, Robust Customer Support and Reduced User Interruptions Backed by Internet Protection Plan with Coverage up to $10,000 Read More »

Conpart AS Joins HDP User Group International

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Scottsdale, Arizona (PRWEB) February 13, 2009 The High Density Packaging User Group International, Inc. (HDP User Group), a global non-profit cooperative research and development organization for the Electronics Manufacturing industries, announces that Conpart AS has joined the organization. Conpart AS will participate in HDP User Group’s technical programs. The HDP organization and its member

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HDP User Group International Publishes General Purpose Lead Free Process Optimization Project Report

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Scottsdale, Arizona (PRWEB) July 31, 2009 The High Density Packaging User Group International, Inc. (HDP User Group), a global non-profit cooperative research and development organization for the Electronics Manufacturing industries, announced the publication of the General Purpose Lead Free Process Optimization project report. The report details the activities and results of an extensive study involving

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Fujitsu, NEC and Toshiba Agree on Common Specifications for “Burst Mode” Pseudo SRAM User Interface

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(PRWEB) February 19, 2003 Frankfurt, February 17th, 2003 – Fujitsu, NEC and Toshiba announced today that they have reached an agreement on common specifications for Pseudo Static Random Access Memory (PSRAM) *1 devices that feature burst mode function enabling fast access operation. Each of the three companies will independently manufacture and market PSRAM products based

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Senju Manufacturing Joins HDP User Group International

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Scottsdale, AZ (PRWEB) July 30, 2010 The High Density Packaging User Group International, Inc. (HDP User Group), a global non-profit cooperative research and development organization for the Electronics Manufacturing industries, announces that Senju Manufacturing has joined the organization. Senju will participate in HDP User Group’s technical programs. The HDP organization and its member companies

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HDP User Group Initiates Optoelectronics Project

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Scottsdale, AZ (PRWEB) August 9, 2010 The High Density Packaging User Group International, Inc. (HDP User Group), a global non-profit cooperative research and development organization for the Electronics Manufacturing industries, announces the start of a new project group focusing on optical electronics. At this time the projects is in definition stage, and open to all

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Seminars Offered on Embedded Design with a Voice User Interface

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Santa Clara, CA (PRWEB) August 18, 2004 Sensory, Inc., the world’s leading supplier of embedded speech technology today announced it is launching a series of training seminars to assist developers in using speech chips within their product designs. Four locations and dates have been announced: Hong Kong, China: September 23-24, 2004 East

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HDP User Group Launches New Revision of its Board Mounted Power Supplies Guideline

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Scottsdale, Arizona (PRWEB) November 8, 2010 The High Density Packaging (HDP) User Group now announces the launch of its second edition of Board Mounted Power Supply (BMPS) Application Guidelines. First, launched in March 2007, it was designed to support the communications and electronics manufacturing industry by promoting better understanding of BMPS products. Since then major

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HDP User Group Initiates Integrated Circuit Attachment to Printed Electronics Substrates Project

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Paradise Valley, AZ (PRWEB) February 2, 2011 The High Density Packaging User Group International, Inc. (HDP User Group), a global non-profit cooperative research and development organization for the Electronics Manufacturing industries, announces the start of a new project group focusing on printed electronics. At this time the project is in the idea stage and open

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