Conpart AS Joins HDP User Group International

Scottsdale, Arizona (PRWEB) February 13, 2009

The High Density Packaging User Group International, Inc. (HDP User Group), a global non-profit cooperative research and development organization for the Electronics Manufacturing industries, announces that Conpart AS has joined the organization. Conpart AS will participate in HDP User Group’s technical programs.

The HDP organization and its member companies are excited about the addition of Conpart AS and look forward to sharing knowledge in current and future projects that will benefit all. “Conpart is at the forefront of advanced electronics packaging and assembly technology. Their knowledge and expertise will be a valuable addition to HDP User Group’s activities in that area,” said Marshall Andrews, Executive Director of HDP User Group International.

“Joining the HDP organization is an important step for Conpart in the effort to build our network and to spread the word about our activities” says Tom Ove Gr


About The Author

Ibrar Ayyub

Ibrar Ayyub is an experienced technical writer with a Master's degree in computer science from BZU Multan University. He has written for various industries, mainly home automation, and engineering. He has a clear and simple writing style and is skilled in using infographics and diagrams. He is a great researcher and is able to present information in a well-organized and logical manner.

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