Scottsdale, Arizona (PRWEB) February 13, 2009
The High Density Packaging User Group International, Inc. (HDP User Group), a global non-profit cooperative research and development organization for the Electronics Manufacturing industries, announces that Conpart AS has joined the organization. Conpart AS will participate in HDP User Group’s technical programs.
The HDP organization and its member companies are excited about the addition of Conpart AS and look forward to sharing knowledge in current and future projects that will benefit all. “Conpart is at the forefront of advanced electronics packaging and assembly technology. Their knowledge and expertise will be a valuable addition to HDP User Group’s activities in that area,” said Marshall Andrews, Executive Director of HDP User Group International.
“Joining the HDP organization is an important step for Conpart in the effort to build our network and to spread the word about our activities” says Tom Ove Gr