Switch

Switch debounce library 1

Switch debounce library

Contact bounce (ref. https://en.wikipedia.org/wiki/Switch#Contact_bounce) is a common problem with mechanical switches and relays. Switch and relay contacts are usually made of springy metals. When the contacts strike together, their momentum and elasticity act together to cause them to bounce apart one or more times before making steady contact. You can find below a sample of a bouncy

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Current Sensor Amplifier & Over Current Switch

Current sensor amplifier and over current switch project is based on ACS714-30A current sensor and LM358 Op-amp, ½ of  LM358 op-amp used as an amplifier for low voltage  and 2nd 1/2 LM358 op-amp used as comparator which provides over current TTL output, trimmer potentiometer provided to set the over current limit.  ACS714 sensor measures the

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A Cost-efficient Super-Cascode SiC Switch

Researchers have created a high voltage and high frequency silicon carbide (SiC) power switch that could cost much less than similarly rated SiC power switches. The findings could lead to early applications in the power industry, especially in power converters like medium voltage drives, solid state transformers and high voltage transmissions and circuit breakers. Researchers

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Testing Device for DiSEqC-Switches using ATtiny13-20PI

This is my first AVR-project on this page. The DiSEqC-Tester allows to test DiSEqC-switches that uses 1.0 or 1.1 protocols. (DiSEqC-Switches with 2.0 and 2.1 protocol have backwards compatibility with 1.0 & 1.1 respectively and also may be tested). The device every second sends a DiSEqC-message that makes switch a DiSEqC-switch. Four LEDs are intended

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MEMtronics Receives Phase 2 Award for DARPA RF MEMS Switch Development – Company’s technology increases environmental robustness of wireless systems

(PRWEB) May 5, 2005 Part of the Harsh Environment Robust Micromechanical Technology (HERMIT) Program, the first phase of this contract recently culminated in the successful demonstration of a wafer-level packaging technology called “wafer-level microencapsulation.” This packaging scheme protects MEMS switches from the adverse effects of moisture and particles. The microfabricated packages have extremely low loss

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