NXP Introduces LIN Transceiver for Smaller, Lighter and More Cost-Efficient ECU Designs

Summary of NXP Introduces LIN Transceiver for Smaller, Lighter and More Cost-Efficient ECU Designs


NXP Semiconductors launched the TJA1027, a standalone LIN 2.2 transceiver designed to create smaller, lighter, and cost-efficient automotive electronic control units (ECUs). Ideal for body control modules and slave applications like window lifters, it simplifies designs by removing specific wake-up features. Available in SO8 and compact HVSON8 packages, the device offers enhanced ESD protection, reducing external component needs while meeting strict environmental standards.

Parts used in the TJA1027 Project:

  • TJA1027 Transceiver
  • SO8 Package
  • HVSON8 Package
  • Dark Green Molding Compound
  • ESD Protection Circuitry
  • Electronic Control Units (ECUs)
  • Electrical Window Lifters
  • HVAC Systems


Eindhoven, Netherlands (PRWEB) February 23, 2012

NXP Semiconductors N.V. (NASDAQ: NXPI) the worlds largest supplier of in-vehicle networking (IVN) semiconductors today announced the availability of the TJA1027, a standalone LIN 2.2 transceiver that enables smaller, lighter and more cost-efficient electronic control units (ECUs) in cars. The TJA1027 is ideal for body control and gateway modules, particularly where there are board space constraints due to high node count, and also for typical slave applications such as electrical window lifters or HVAC (heating, ventilation and air conditioning) systems.

 

The TJA1027 was designed in response to manufacturer demands for a simpler transceiver while still preserving the core functionality required for typical automotive ECU applications. By removing the local wake-up input and battery-related inhibit output features, the TJA1027 enables more cost-effective designs.

 

The new transceiver is available in two package variants a standard SO8 package, plus a leadless HVSON8 package. Approximately 70-percent smaller and lighter than a conventional SO8 package, the HVSON8 is eco-friendly and saves space. Its compact size and reduced weight enables smaller, more cost-effective ECU modules, helping to reduce CO2 emissions. In addition, the HVSON8 package uses a dark green molding compound that is free of halogen and meets the RoHS (Restriction of Hazardous Substances) standard. The HVSON8 package has identical pin-out as the industry standard LIN transceiver in SO8, which eases the package adoption.

 

The TJA1027 integrates high protection against ESD pulses (+/- 8kV according to IEC 61000-4-2) on the bus pin. Thus, it further reduces system costs by removing the need for external ESD protection diodes while offering an excellent EMC profile, meeting the latest requirements of car OEMs.

 

The release of the TJA1027 is another proof point of NXPs technology and market leadership in in-vehicle networking semiconductors. We developed this product in collaboration with major automotive manufacturing customers, responding to their need for a simpler and more cost-effective transceiver that still offers full functionality, said Stephan Rave, product marketing manager, NXP Semiconductors. The TJA1027 is also another example of our support for the HVSON package, which we believe is the next step in the evolution of in-vehicle networking transceivers.

 

Features

Quick Solutions to Questions related to TJA1027 Project:

  • What is the primary function of the TJA1027?
    The TJA1027 is a standalone LIN 2.2 transceiver enabling smaller, lighter, and more cost-efficient ECUs.
  • Which automotive applications is the TJA1027 ideal for?
    It is ideal for body control, gateway modules, electrical window lifters, and HVAC systems.
  • How does the HVSON8 package compare to the SO8 package?
    The HVSON8 package is approximately 70-percent smaller and lighter than the conventional SO8 package.
  • Does the TJA1027 require external ESD protection diodes?
    No, its integrated high protection against ESD pulses removes the need for external ESD protection diodes.
  • What environmental standard does the HVSON8 molding compound meet?
    The dark green molding compound is free of halogen and meets the RoHS standard.
  • Can the HVSON8 package be easily adopted for existing designs?
    Yes, it has an identical pin-out as the industry standard LIN transceiver in SO8.
  • Why was the local wake-up input removed from this design?
    Removing this feature allows for simpler and more cost-effective designs while preserving core functionality.
  • What ESD pulse protection level does the bus pin offer?
    The bus pin integrates high protection against ESD pulses of plus or minus 8kV according to IEC 61000-4-2.

About The Author

Ibrar Ayyub

I am an experienced technical writer holding a Master's degree in computer science from BZU Multan, Pakistan University. With a background spanning various industries, particularly in home automation and engineering, I have honed my skills in crafting clear and concise content. Proficient in leveraging infographics and diagrams, I strive to simplify complex concepts for readers. My strength lies in thorough research and presenting information in a structured and logical format.

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