Summary of DA14531 SMARTBOND TINY™ MODULE IS THE BLUETOOTH® LOW ENERGY SOLUTION THAT WILL POWER THE NEXT 1 BILLION IOT DEVICES THROUGH EASE OF USE
Dialog Semiconductor launched the DA14531 SmartBond TINY module, a cost-effective Bluetooth Low Energy (BLE) solution for IoT devices. It features integrated components and two software innovations: Dialog Serial Port Service (DSPS) and Codeless software, which simplify development by replacing complex coding with ASCII commands. Designed for consumer, medical, and smart home applications, the module costs under $1 while offering 9 GPIOs and an integrated antenna.
Parts used in the DA14531 SmartBond TINY Module:
- DA14531 SoC
- Integrated antenna
- Passive components
- XTAL (Crystal oscillator)
- FLASH memory
- 9 GPIOs
Dialog Semiconductor plc, a leading provider of power management, charging, AC/DC power conversion, BLE, low power Wi-Fi and Industrial ICs, today announced the availability of the DA14531 SmartBond TINY module, empowering customers to build the next generation of connected devices.
The SmartBond TINY module was specifically optimized to significantly reduce the cost of adding Bluetooth low energy functionality to an IoT system. Its easy-to-use design and software allow developers to quickly and intuitively develop highly functional connected devices, targeting the next generation of connected consumer, connected medical, smart home and smart appliance applications. The module incorporates two unique software features designed to eliminate the complexity often associated with traditional Bluetooth low energy development and empowers customers to develop robust IoT products regardless of their software coding capabilities.
The first is the configurable Dialog Serial Port Service (DSPS) software, which emulates a universal asynchronous receiver-transmitter (UART) serial port over BLE, removing the need to write Bluetooth software for “BLE Pipe” applications when connecting the module to a host MCU’s serial port. The second feature, Dialog’s new Codeless software, takes this concept even further by replacing complex code with a simple series of human readable ASCII commands that can be used to generate customer applications. Codeless uses the industry standard Hayes AT-style command set to configure and operate the module.
The launch of the SmartBond TINY DA14531 SoC in 2019 set a new industry benchmark for BLE SoC pricing, at less than 50 cents. The DA14531 module further leverages the capabilities of the SoC, including an integrated antenna and all required components, to add BLE functionality to an IoT system in high volumes at a cost of under $1. That price point for BLE functionality, performance and quality is unmatched by competitors,” said Sean McGrath, Senior VP, Connectivity and Audio BG, Dialog Semiconductor. “Not only is this module breaking barriers in terms of cost and power, it is extremely easy for both beginners and experts to use, ensuring that all customers can benefit from its high level of integration and programmable ease of use.
The hand solderable stamp type module offers 9 GPIO’s and measures 12.5 x 14.5mm in size. All external components, including passives, XTAL, antenna and FLASH memory, are integrated into the SmartBond TINY module, so that customers don’t need to source individual components separately.
- How does the module reduce development complexity?
It uses configurable DSPS software to emulate a UART serial port and Codeless software that replaces code with human-readable ASCII commands. - What is the cost of adding BLE functionality with this module?
The module adds BLE functionality at a cost of under $1 for high-volume production. - Can beginners use this module?
Yes, the module is designed to be easy for both beginners and experts to use regardless of their software coding capabilities. - Does the module require sourcing external components separately?
No, all external components including passives, XTAL, antenna, and FLASH memory are integrated into the module. - What command set does the Codeless software use?
Codeless uses the industry standard Hayes AT-style command set to configure and operate the module. - What applications target this module?
The module targets connected consumer, connected medical, smart home, and smart appliance applications. - What is the size of the hand solderable stamp type module?
The module measures 12.5 x 14.5mm in size. - How many GPIOs does the module offer?
The module offers 9 GPIOs.
