New Software Version – CDS Announces the Release of Version 7.4.

San Jose, CA (PRWEB) March 30, 2006

CAD Design Software announces the release of the latest version of their advanced layout tools. Two years in development, Version 7.4 is the largest and most extensive expansion of CAD Design Softwares high-end EDA tools and is the culmination of extensive collaborative relationships with many industry leaders in the U.S., Japan, and Asia in the Semiconductor Packaging, Hybrid/MCM, IC Test, and RF/Microwave fields.

Because of our ongoing partnership with the top industry leaders, we have not only been able to rapidly implement enhancement requests, but have been able to jointly develop new layout solutions for emerging technologies as well as create previously unavailable 3D manufacturing verification systems. This has resulted in our most advanced and expanded 3D layout solutions for leading-edge IC packaging, IC Test, RF, and MCM layout, said Gordon Jensen, president of CAD Design Software.

More robust, sophisticated algorithms for faster processing and CAD Design Softwares award-winning Bond Wire Optimization and 3D design tools are among the hundreds of enhancements and improvements that help reduce design time, improve overall time-to-market, and verifiably improve yields.

CAD Design Softwares Version 7.4 is unsurpassed in features, functions, and most of all, flexibility. CAD Design Software leads the EDA industry with the most rapid development and implementation of new tools for emerging high-end new technologies for its customers. This has resulted in many industry firsts, including Stacked Die, 3D design, automated IC package routing, co-development and design-for-manufacture (DFM) platforms.

Version 7.4 is available now from CAD Design Software and its channel partners. For more information call 877-223-8737 or visit us at

About CAD Design Software:

CAD Design Software provides complete 3D Electronic Design Automation solutions for semiconductor packaging and PCB designs disciplines using Electronics Packaging Designer (EPD) software suites for applications such as BGA, uBGA, Hybrid/MCM, Lead Frame, Stacked Die, IC Test, RF/Microwave, Flex and other design technologies. For more information on CAD Design Software, call 877-223-8737, visit our web site at


About The Author

Ibrar Ayyub

Ibrar Ayyub is an experienced technical writer with a Master's degree in computer science from BZU Multan University. He has written for various industries, mainly home automation, and engineering. He has a clear and simple writing style and is skilled in using infographics and diagrams. He is a great researcher and is able to present information in a well-organized and logical manner.

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