Palatine, IL (PRWEB) August 31, 2011
As the only US based provider of LDS technology, SelectConnect Technologies fills a void in the marketplace with the introduction of 3-D design capabilities that create electromechanical functionality on molded devices.
Known as laser direct structuring (LDS) technology, LDS allows for more freedom in geometric 3-D design. Electromechanical circuits are produced on molded thermoplastic components for applications such as; antenna used for cellular, GPS, Wi-Fi, Bluetooth and ISM band applications, automotive sensors, medical devices, RFID, and security housings.
A newly acquired LPKF Microline 160 3-D laser system transfers the electromechanical design from a CAD data file directly onto a molded thermoplastic component or into a device structure. The circuit traces are embedded onto the thermoplastic component by the laser. Then electrical pathways and landings are electroless plated using the patented SelectConnect process for metallizing circuits on molded components. Surface mount components (SMT) can then be attached using reflow soldering or wire bonding.
With LDS technology the time it takes to get designs to market is greatly reduced. Design changes are handled in hours instead of the weeks required by traditional prototyping methods. Changes are quickly made to the CAD file and uploaded to the laser. Parts are then etched and metalized. In many instances, new parts are ready for testing the very next day.
LDS applications for 3-D MIDs have increased worldwide due to the need to reduce bill of material (BOM), the complexity of the component, size, weight, and assembly times by having fewer components, wires and interconnects.
About SelectConnect Technologies:
SelectConnect Technologies a division of Arlington Plating Company is the only US provider of LPKFs LDS process. SelectConnect Technologies is ISO 9001 and ITAR registered. Visit us at http://www.selectconnecttech.com.
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