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Molded

SelectConnect Technologies Introduce 3-D Design Capabilities That Create Electromechanical Functionality On Molded Devices

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Palatine, IL (PRWEB) August 31, 2011 As the only US based provider of LDS technology, SelectConnect Technologies fills a void in the marketplace with the introduction of 3-D design capabilities that create electromechanical functionality on molded devices. Known as laser direct structuring (LDS) technology, LDS allows for more freedom in geometric 3-D design. Electromechanical […]

SelectConnect Technologies Introduce 3-D Design Capabilities That Create Electromechanical Functionality On Molded Devices Read More »

SelectConnect Technologies and Val Tech Group Partner To Provide Three-Dimensional Molded Interconnect Device Solutions

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Palatine, IL (PRWEB) December 30, 2011 SelectConnect Technologies, Palatine, Illinois and The Val Tech Group, Rochester, New York have partnered together to provide three-dimensional molded interconnect device (3D-MID) solutions. 3D-MID are alternatives for flex circuits, circuit boards, wiring and connectors that incorporate electronic circuits onto injection molded thermoplastic components for the medical device, mobile antenna,

SelectConnect Technologies and Val Tech Group Partner To Provide Three-Dimensional Molded Interconnect Device Solutions Read More »

The World’s Premiere Source for Information on 3-Dimensional Molded Interconnect Devives – 3dmid Blog is Now Part of SelectConnectTech.com

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Palatine, IL (PRWEB) March 28, 2012 3-D MID blog, the Worlds premiere source for information regarding 3-Dimensional Molded Interconnect Devices (3-D MID) becomes wholly integrated into SelectConnectTech.com SelectConnect Technologies is honored to be entrusted with the continuation of such a respected information source to the 3-D MID industry. 3-D MIDs are formed through

The World’s Premiere Source for Information on 3-Dimensional Molded Interconnect Devives – 3dmid Blog is Now Part of SelectConnectTech.com Read More »

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