Palatine, IL (PRWEB) March 28, 2012
3-D MID blog, the Worlds premiere source for information regarding 3-Dimensional Molded Interconnect Devices (3-D MID) becomes wholly integrated into SelectConnectTech.com
SelectConnect Technologies is honored to be entrusted with the continuation of such a respected information source to the 3-D MID industry.
3-D MIDs are formed through a variety of methods. The foremost methods are Laser Direct Structuring(LDS) and the selective metallization of components made using the double-shot method.
According to Stephan Schmidt, President of LPKF USA 3-D MIDs bridge the gap between a circuit board, wiring harness and plastic parts.
Laser Direct Structuring is a process in which circuitry and/or antenna pattern are laser etched directly onto the surface of a thermoplastic molded component or chassis. The thermoplastic is doped with a compound that once laser activated accepts metallization creating a conductive path.
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