(PRWEB) October 13, 2004
It is the leading one-stop turnkey wafer sort, IC assembly & test subcon facility in india and it offers onsite & offshore test engineering support to customers. Assembly of wide range of packages from through-hole to surface mount at low assembly cost and its ability to assemble thin packages (1.0 mm), handle very low loop (5mils) and fine bond pad pitch (50 microns). Quality at SPEL is the means to customer satisfaction and it strives to keep the failure costs low and passes on the accrued benefits to the customer. Considerable indirect cost savings owing to turnkey services offered from wafer Sort to tape & reel to direct drop shipments to end-Customers.spel semiconductor,IC assembly and testing india,IC assembly subcontractors,turnkey IC services,Integrated circuit tester, Semiconductor testing, Component Testing,Product Engineering Support,Lead Scan Inspection,ATE,DIP package assembler,SOP package,laser marking in package,wire bond technology,die bond technology,wafer probing technology,molding in IC,smd handlers,smd packages,dicing,dejunk,IC testing subcon,package manufacturers,BVQI quality certification,IC assembly – ISO standard,testing for IC reliability,IC testing – ISO standard,IC test handlers,plating in IC assembly,Test Software Development,Wafer testing,Wafer Sorting,Die Sorting,Silicon Verification,IC products drop shipment,IC assembly subcon,digital IC tester,SAC subcontractor,forming in IC assembly,wafer IC pin,Semiconductor India,Electronic Manufacturing India,IC test services,Tape & Reel packing,Product Characterisation,Test Solutions.
For more information, visit us at:
http://www.spel.com/
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