HDP User Group Initiates Integrated Circuit Attachment to Printed Electronics Substrates Project
Paradise Valley, AZ (PRWEB) February 2, 2011 The High Density Packaging User Group International, Inc. (HDP User Group), a global non-profit cooperative research and development organization for the Electronics Manufacturing industries, announces the start of a new project group focusing on printed electronics. At this time the project is in the idea stage and open […]